Senior Packaging Engineer

Sandisk; Bengaluru; On-site; INR 1,000,000 - 1,800,000; Full time

Job summary

Sandisk invites a hands-on Packaging Engineer to drive SSD package development from concept through qualification and high-volume manufacturing ramp. You will partner with global design, reliability, process, operations, OSAT, and supplier teams to deliver manufacturable, reliable packaging solutions.

The role requires a Master’s degree with 3–5 years of experience (or 0–3 years with a PhD), strong SMT/PCBA understanding, and experience in DOE and reliability analysis.

Qualifications

• Master’s degree in Materials Science, Manufacturing, Mechanical Engineering, Packaging Engineering, or related field.
• 3–5 years of relevant experience with a master’s degree, or 0–3 years with a PhD.
• Strong understanding of SMT, PCBA, PCB layout, solder joint reliability, board-level reliability, packaging materials, and failure analysis.
• Experience with DOE, statistical analysis, structured problem solving, and tools such as Minitab, JMP, or equivalent.
• Ability to work effectively in a fast-paced, cross-functional, global environment with strong communication and execution skills.

Responsibilities

• Support SSD package development from concept, design validation, qualification, and high-volume manufacturing ramp.
• Review package design drawings and provide feasibility feedback, DFX input, and improvement recommendations.
• Collaborate with global engineering, reliability, process, operations, OSAT, and supplier teams to ensure design implementation and manufacturing readiness.
• Support engineering builds, characterization, package qualification plans, and risk mitigation activities.
• Monitor assembly and test yield, support failure analysis, and drive corrective and preventive actions.
• Contribute to assembly process flows, work instructions, FMEA/PFMEA, control plans, process recipes, and SPC monitoring.
• Support the introduction of new packaging technologies, materials, and processes into production.

Skills

SMT knowledge

PCBA fundamentals

Solder joint reliability

Statistical analysis

Cross-functional work

Education

Master’s degree in Materials Science / Packaging Engineering

Tools

Minitab

JMP

Job description

• Job Type (exemption status): Exempt position - Please see related compensation & benefits details below
• Business Function: Packaging Engineering

Company Description

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

Job Description

We are looking for a hands-on Packaging Engineer to support SSD package development from concept through qualification and high-volume manufacturing. This role will work closely with global design, reliability, process, operations, OSAT, and supplier teams to deliver innovative, manufacturable, and reliable packaging solutions.

• Support SSD package development from concept, design validation, qualification, and high-volume manufacturing ramp.
• Review package design drawings and provide feasibility feedback, DFX input, and improvement recommendations.
• Collaborate with global engineering, reliability, process, operations, OSAT, and supplier teams to ensure design implementation and manufacturing readiness.
• Support engineering builds, characterization, package qualification plans, and risk mitigation activities.
• Monitor assembly and test yield, support failure analysis, and drive corrective and preventive actions.
• Contribute to assembly process flows, work instructions, FMEA/PFMEA, control plans, process recipes, and SPC monitoring.
• Support the introduction of new packaging technologies, materials, and processes into production.

Qualifications

Required Qualifications

• Master’s degree or higher in Materials Science, Manufacturing, Mechanical Engineering, Packaging Engineering, or related engineering disciplines.
• 3–5 years of relevant experience with a master’s degree, or 0–3 years with a PhD.
• Strong understanding of SMT, PCBA, PCB layout, solder joint reliability, board-level reliability, packaging materials, and failure analysis.
• Experience with DOE, statistical analysis, structured problem solving, and tools such as Minitab, JMP, or equivalent.
• Ability to work effectively in a fast-paced, cross-functional, global environment with strong communication and execution skills.

Preferred Qualifications

• Excellent written and communication skills, enabling collaboration with global functional teams
• Knowledge of thermo-mechanical aspects of semiconductor packages
• Knowledge in data analytics or AI/ML techniques is a plus.

Additional Information

Sandisk is committed to providing equal opportunities to all applicants and employees and will not discriminate based on their race, color, ancestry, religion (including religious dress and grooming standards), sex (including pregnancy, childbirth or related medical conditions, breastfeeding or related medical conditions), gender (including a person’s gender identity, gender expression, and gender-related appearance and behavior, whether or not stereotypically associated with the person’s assigned sex at birth), age, national origin, sexual orientation, medical condition, marital status (including domestic partnership status), physical disability, mental disability, medical condition, genetic information, protected medical and family care leave, Civil Air Patrol status, military and veteran status, or other legally protected characteristics. We also prohibit harassment of any individual on any of the characteristics listed above. Our non-discrimination policy applies to all aspects of employment. We comply with the laws and regulations set forth in the Equal Employment Opportunity is the Law poster.

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [emailprotected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.