Senior Digital PD Engineer

Texas Instruments; Bengaluru; On-site; INR 2,200,000 - 4,200,000; Full time

Job summary

Texas Instruments in Bengaluru, India, is seeking a design engineer to own the physical design lifecycle for high-speed mixed-signal and digital circuits, interfacing with analog IP.

You will lead floorplanning, placement, timing closure, routing, and reliability checks, mentor peers, and collaborate with EDA, library, memory, and IP teams to deliver robust, scalable digital backends.

Job description

Change the world. Love your job.

In this position, you will be working on high-speed mixed-signal communication circuits using state-of-the art process technology, as well as be involved in the design of high performance digital circuits interfacing to leading edge analog circuitry as part of an overall system.

Your responsibilities will include RTL coding, simulation, synthesis, timing closure, verification, evaluation, debugging of high-speed communication chips both at the circuit level and behavioral level.

As a design engineer, you will prepare test methods and specifications, assist in preparation of application information, data sheets and demo boards. You will develop solutions to complex problems through assessment of various techniques and approaches. You will plan and organize work to ensure timely completion of many independent tasks with general instructions on routine tasks and with detailed instructions on new assignments.

This position involves routine communication with a highly talented team of analog and digital design engineers to solve problems and present information as well as active participation in work groups, providing ideas and collaborative teamwork.

Who are we and what do we do?

The Advanced Circuits and Power Solutions business is known for delivering industry-leading custom IC system solutions, including display and touch power products, charger power products, camera PMICs, power path devices, sensing devices, and high-performance communication interface products. Our products integrate precision signal chains and highly efficient power components into ultra-small form factors, enabling TI’s best-in-class customers to translate their ideas into high-value products that revolutionize the personal electronics market.

In this team, you will work with and learn from incredibly talented technical leaders who have influenced TI’s technology, productivity, and way of working in creative and impactful ways. You will directly interact with one of TI’s most valued, high-volume customers through intense technical reviews and architecture discussions!

By enabling designs that are highly impactful to TI revenue and working with a critical customer on a versatile set of products, you will find yourself on an accelerated career path.

About the job

If you are looking to join an ingenious, vigorous & ambitious team that consistently delivers groundbreaking technologies into the custom mobile electronics world, here is an opportunity for you!

What will you be doing in this role?

Strategic Leadership & Industry Authority

• Technology Roadmap & Vision: Own the strategic direction of physical design at TI, establishing the methodologies, quality benchmarks, and technical judgments that form the foundation for TI's next generation of products.
• Industry & Customer Influence: Serve as TI's technical authority in high-stakes customer engagements and partner discussions, communicating complex physical design decisions with authority and clarity.
• Design Governance & Quality Authority: Act as the global quality authority for the digital backend, owning the sign-off for the complete flow from RTL to GDSII and setting the quality standards that projects across TI measure themselves against.
• Cross-Functional Orchestration: Orchestrate deep collaboration with EDA, Library, Memory, and IP teams to eliminate flow bottlenecks, align execution priorities, and raise the implementation bar across all TI projects.

Architectural Influence & Methodology Innovation

• Upstream Design Shaping: Embed "design-for-implementation" thinking into early-stage architecture and front-end decisions to mitigate costly backend constraints before they arise.
• Methodology & Flow Engineering: Define and establish TI-wide physical design methodologies and flows, ensuring they are robust, scalable, and optimized for the latest process nodes.
• EDA & Node Qualification: Evaluate and qualify new EDA tools and process nodes, driving adoption decisions through data-driven recommendations and rigorous benchmarking.
• Mentorship: Elevate the physical design community at TI by mentoring engineers, standardizing implementation practices, and building lasting institutional knowledge.

Technical Execution & Optimization

• End-to-End Flow Ownership: Independently drive the entire Physical Design lifecycle, including floorplanning, placement, CTS, routing, and full-chip implementation.
• Timing & Reliability Closure: Lead rigorous Static Timing Analysis (STA) and ensure total closure for EM (Electromigration), IR drop, and Physical Verification (DRC/LVS).
• PPA Optimization: Drive aggressive techniques to optimize Power, Performance, and Area (PPA) to ensure TI’s silicon remains industry-leading and highly competitive.
• Clock & Reset Integrity: Analyze and influence clock, reset, and DFT architectures to ensure they are fully optimized for physical implementation and reliability.