Package Reliability Engineer

Micron Technology; Sanand; On-site; INR 1,000,000 - 1,800,000; Full time

Job summary

Micron Technology Inc. is seeking a GQ Package Reliability Engineer in Gujarat to help ensure product quality and durability. You will coordinate package qualification for new products, assess reliability risks, and influence release decisions based on test data.

You will develop test plans, manage root cause analysis and corrective actions, and support internal and external customers on package reliability. Strong knowledge of SMT, reliability methodologies, and AI-enabled tooling is a plus.

Qualifications

• BS degree in Engineering or equivalent.
• 2+ years in Micro Electronic Packaging or related field preferred.
• Fresh graduates welcome to apply.

Responsibilities

• Coordinate package qualification for new products and builds.
• Support reliability risk assessment and testing plans.
• Lead root cause analysis and corrective actions for qualification failures and RMAs.

Skills

Package assembly

Reliability testing

Root cause analysis

Data analysis

AI literacy

Education

BS degree in Engineering

Tools

Microsoft Copilot

GenieLLM

Job description

Job Description:

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a GQ (Global Quality) Package Reliability Engineer at Micron Technology Inc., you will contribute significantly to assuring the outstanding quality and durability of Micron’s products. This distinctive position allows you to coordinate package qualification for new products and innovative builds, materials, and processes. Your insights will influence product release recommendations derived from package reliability test data, enabling Micron to compete worldwide.

You will develop reliability test plans to evaluate risks related to excursions, conversions, and qualification concerns. Additionally, you will manage root cause analysis and corrective measures within the GQ department for package-related qualification failures and RMAs, preparing detailed reports for review. Cooperation is essential as you offer assistance to internal and external customers regarding package-related quality and reliability matters, addressing customer inquiries promptly.

Job Responsibilities

• Coordinate package qualification efforts for new products and innovative builds
• Offer suggestions regarding product launch grounded in reliability test outcomes
• Develop reliability test plans to evaluate risk related to excursions, conversions, and qualification issues
• Coordinate root cause analysis and corrective action efforts within the GQ department for qualification failures and RMAs
• Prepare detailed reports for discussion
• Offer assistance to internal and external customers regarding package-related quality and reliability concerns

Successful Candidates Will Have

• Detailed understanding of semiconductor component package assembly processes and challenges
• Understanding of surface mount methods and associated challenges
• Understanding of mechanical and material interaction effects on IC components and/or PCB assemblies
• Good understanding of the effects of thermomechanical, thermal, mechanical, and hygroscopic swelling stresses on package reliability
• Practical understanding of industry-recognized reliability test techniques, acceleration models, and sampling statistics
• Self-motivation, independence, and attention to detail
• Strong analytical problem-solving skills, excellent multi-tasking abilities, and the ability to interact easily with other groups
• Good written and verbal communication skills
• Practical understanding of software systems used in backend manufacturing
• Demonstrate digital and AI fluency by effectively utilizing tools such as Microsoft Copilot, GenieLLM, and AI agents to support technical analysis, documentation, workflow automation, and continuous improvement initiatives. Candidates should be eager to adopt emerging AI technologies to drive productivity and innovation.

Qualification Requirements

• Minimum of a BS degree, M.Sc, or comparable experience in Engineering or a related field
• Experience in Micro Electronic Packaging, Quality/Reliability Engineering, Failure Analysis, or a related field is preferred
• Fresh graduates or candidates with less than 2 years of working experience are welcome to apply

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities – from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.