Operator - NPI & Engineering

CYIENT DLM; Hyderabad; On-site; INR 900,000 - 1,300,000; Full time

Job summary

Cyient DLM, Shamshabad, Hyderabad, India, is seeking an experienced engineer to lead box build assemblies and NPI activities in an EMS environment. You will interpret mechanical drawings, ensure EMI shielding and seal integrity, and drive process improvements from proto to mass production.

The role covers bonding, potting, conformal coating, ECO/ECN changes, and documentation while coordinating with design, QA, and suppliers to ensure readiness and compliance with IPC standards.

Qualifications

• Diploma in Mechanical or Electronics.
• 5–12 years in EMS / electronics manufacturing.
• Experience inbox build and NPI engineering preferred.
• IPC certification (CIT/CIS) preferred.

Responsibilities

• Lead box build assemblies including cable harness routing and mechanical fitting.
• Plan, implement, and support assembly, bonding, potting and conformal coating processes.
• Drive NPI execution, ECO/ECN changes and process validation.
• Coordinate with design, quality, supply chain and customers for readiness.
• Improve FPY and reduce rework; monitor KPIs like cycle time and yield.
• Define fixtures, jigs, and automate coating/dispensing where possible.

Skills

Box build assembly

IPC standards

CAD drawings interpretation

Thermal management

EMI/EMC considerations

Environmental protection methods

Problem solving

Cross-functional collaboration

Documentation skills

Education

Diploma in Mechanical / Electronics

5–12 years in EMS / electronics manufacturing

Experience in box build and NPI engineering

Tools

Coating/dispensing equipment

Job description

Shamshabad, Hyderabad, India | Posted on 29/08/2026

A Design Led Manufacturing Partner to meet complex product requirements.

For over 30 years, Cyient DLM has been a trusted electronics and mechanical manufacturing partner and systems supplier to some of the largest players across multiple industries. As an integrated manufacturing partner that provides Design Led Manufacturing (DLM) solutions to customers, we take ownership of design, manufacturing, testing, and certification support to ensure that customers' products meet robust standards in reliability, safety, and performance. We have expertise in safety-critical electronics in highly regulated industries. Our engineers have significant design and manufacturing expertise that helps our customers build complex products and achieve faster time-to-market.

Job Description

Organization: CyientDLM Limited

Job Summary

Responsible for leading andsupportingbox build assembly processesincludingmechanicalassembly, bonding, potting, and conformal coating operationsin an EMSenvironment. The role also involvesNPI (New Product Introduction) execution,engineering changes, process optimization, and production readinessfornew and existing products.

Key Responsibilities

1.Box Build & Mechanical Assembly

• Plan, implement, and supportcomplete box buildassembliesincluding:
  
• Cable harness routing and termination
• Mechanical fitting, fastening, and torque control
• Interpretmechanical drawings, BOMs, and assembly instructions
• Ensureproper alignment, sealing, gasket fitting, and EMIshielding
• Drive improvements inassembly methods, ergonomics, and cycletime

2.Bonding, Potting & Conformal Coating

• Define and control processes for:
  
• Bonding (adhesives, sealants, RTV, epoxy)
• Potting & encapsulation (thermal, electrical insulation,vibration protection)
• Conformal coating (acrylic, silicone, urethane, parylene)
• Select materials based onthermal, environmental, andelectrical requirements
• Establishprocess parameters, curing cycles, maskingtechniques
• Ensure compliance withIPC standards (IPC-A-610, IPC-CC-830,J-STD-001)
• Troubleshoot defects such as:
  
• Coating thickness variation
• Lead end-to-endNPI activitiesfrom proto to massproduction:
  
• Feasibility analysis
• Process design and validation
• Line setup and pilot builds
• Coordinate withdesign, quality, supply chain, and customers
• Prepare:
• Work Instructions (WI), SOPs
• PFMEA, Control Plans
• Process flow diagrams
• Conducttrial builds, design validation, and yield improvement

4.Engineering Modifications / Change Management

• Implement and validateEngineering Change Orders (ECO/ECN)
• Evaluate impact of changes on:
  
• Process capability
• Product reliability
• Update documentation, tooling, and fixtures accordingly
• Supportroot cause analysis (RCA)and corrective actions(CAPA)

5.Process Improvement & Quality

• ImproveFPY (First Pass Yield), reduce rework and scrap
• Monitor process KPIs:
  
• Cycle time
• Yield
• Work closely with QA for:
  
• Failure analysis
• Reliability testing
• Audit compliance

6.Tooling & Equipment Management

• Define and validatefixtures, jigs, and assembly tools
• Supportautomation opportunitiesin coating/dispensingprocesses
• Maintain equipment calibration & preventive maintenance plans

7.Documentation & Compliance

• Ensure adherence to:
  
• IPC / ISO standards
• Customer requirements
• ESD and safety guidelines
• Maintain accurate:
  
• Process documentation
• Build records
• Traceability logs

Requirements

Technical Skills

• Strong knowledge of:
  
• Box build assembly processes
• Familiarity with:
  
• IPC standards (A-610, J-STD-001, CC-830)
• CAD drawings interpretation
• Understanding of:
  
• Thermal management
• EMI/EMC considerations
• Environmental protection methods

SoftSkills

• Problem-solving and analytical thinking
• Cross-functional collaboration
• Strong communication and documentation skills
• Ability to manage multiple NPI projects

Education & Experience

• Diplomain Mechanical / Electronics
• 5–12 yearsin EMS / electronics manufacturing environment
• Experience inbox build and NPI engineering preferred

Preferred Qualifications

• IPC certification (CIT/CIS)
• Experience withautomation in coating/potting dispensingsystems
• Exposure toaerospace, automotive, or high-reliabilityelectronics

Key Performance Indicators (KPIs)

• NPI on-time launch success
• First Pass Yield (FPY)
• Reduction in defects (coating/potting failures)
• Engineering change implementation cycle time