Mechanical Program Lead Engineer

Lam Research Salzburg GmbH; Bengaluru; On-site; INR 1,400,000 - 2,200,000; Full time

Job summary

Lam India Global Hardware Technology (LIGHT) in Bangalore is seeking a Mechanical Program Lead Engineer to own the design, development, and technical ownership of complex mechanical subsystems for wafer fabrication equipment.

You will drive feasibility, architecture decisions, detailed design, and robust release to manufacturing while collaborating with global teams to deliver cost-effective, serviceable hardware for WETS Deposition programs.

Qualifications

• Education: BE/BTech/ME/MTech in Mechanical Engineering.
• Experience: 8–12 years in semiconductor equipment engineering.
• Location: Bangalore, India preferred.

Responsibilities

• Lead end-to-end design of complex subsystems and system-level mechanical architectures for semiconductor processing equipment.
• Drive technical planning: scope, requirements, concept selection, risk mitigation with engineering analyses.
• Own detailed design execution: reviews, GD&T, drawing release, change control.
• Plan and lead verification and validation: feasibility builds, test plans, data review, design closure.
• Partner with cross-functional teams to integrate subsystems and meet milestones.
• Engage suppliers and manufacturing to ensure DFM/DFMA, cost targets, and on-time delivery.
• Lead problem-solving for reliability (RCCA/8D/5-Why) and drive corrective actions.
• Mentor junior engineers and maintain design standards and BKMs.

Skills

Mechanical design

GD&T

DFX

FMEA

Cross-functional collaboration

Project leadership

Education

BE/BTech/ME/MTech in Mechanical Engineering

Tools

FEA

DoE

RCCA

8D problem solving

Job description

In your career, let’s prove what’s possible.

At Lam Research, we create equipmentthat drives technological advancements in the semiconductor industry. Our innovative solutions enable chipmakers to power progress in nearly all aspects of modern life, and it takes each member of our team to make it possible.

Across our organization, our employees come to work and change the world. We take on the toughest challenges with precision and accuracy. We push for the next big semiconductor breakthrough. We lead the way in one of the most critical and fast-moving industries on the planet. And we do it together, with deep connections and limitless collaboration.

The impact we have on the world is made possible by focusing on our people. So we recognize and celebrate our teams’ achievements. We strive to create an inclusive and diverse culture where everyone’s contribution and voice has value. We evaluate and evolve our offerings, so our people receive the support and empowerment to do meaningful things for their lives, careers, and communities.

Because at Lam, we believe that when people are the priority and they’re inspired to unleash the power of innovation for a better world together, anything is possible.

Mechanical Program Lead Engineer

Date: Jul 28, 2026

Location: Bangalore, IN-Bangalore, IN

Worker Category: On-site Flex

The group you’ll be a part of

WETS Deposition group at Lam India Global Hardware Technology (LIGHT) is hiring a Mechanical Program Lead Engineer for its product development engineering and product ownership team.

The impact you’ll make

As an Mechanical Program Lead Engineer, you will lead the design, development, and technical ownership of complex mechanical and electro-mechanical subsystems for wafer fabrication equipment. You will drive early feasibility and architecture decisions, execute detailed design and validation, and ensure robust release to manufacturing through disciplined requirements, risk management, and cross-functional execution. This role partners closely with global engineering, program, and supplier teams to deliver reliable, cost-effective, and serviceable hardware for WETS Deposition product development programs.

What you’ll do

• Lead end-to-end design and delivery of complex subsystems and system-level mechanical architectures for semiconductor processing equipment (e.g., process chambers, chemical delivery, frames, thermal subsystems, automation interfaces, and motion-controlled assemblies).
• Drive technical planning: scope definition, requirements decomposition, concept selection, and risk mitigation using engineering calculations, dFMEA, and DfX.
• Own detailed design execution: design reviews, tolerance strategy (GD&T), drawing/model release, and configuration/change management.
• Plan and lead verification and validation: feasibility builds, test plan development, instrumentation strategy, data review, and design closure.
• Partner with cross-functional global teams (electrical, systems, software, process, program management, product support, quality) to integrate subsystems and deliver program milestones.
• Engage suppliers and manufacturing engineering to ensure design for manufacturability/assembly/service, cost targets, quality, and on-time delivery.
• Lead structured troubleshooting and reliability improvements (RCCA/8D/5-Why) for field and factory issues impacting safety, uptime, yield, and productivity.
• Provide technical mentorship and review for junior engineers; set expectations for analysis quality, documentation, and engineering rigor.
• Develop and continuously improve design standards, Best Known Methods (BKMs), and reusable design content.

Who we’re looking for

Minimum Qualifications:

• Education: B.E. / B.Tech / M.E. / M.Tech in Mechanical Engineering
• Experience: 8 to 12 years of relevant experience, preferably in semiconductor equipment engineering

Preferred qualifications

• Strong mechanical design fundamentals with hands-on ownership from concept through release for high-reliability hardware.
• Expertise selecting materials and finishes for semiconductor environments (metals, ceramics, quartz, polymers, coatings) with contamination and thermal considerations.
• Proficiency in engineering analyses: structural/FEA, thermal/heat transfer, stress and vibration, and fluid/gas flow as applicable.
• Experience with requirements definition and verification/validation planning at system and subsystem level.
• Working knowledge of DoE, FMEA, and DfX (cost, manufacturability, assembly, reliability, safety, testing, and serviceability).
• Strong documentation discipline aligned with Lam/SEMI practices, including GD&T and configuration control.
• Structured problem-solving experience (RCCA, 8D, 5-Why, Fishbone) with a track record of closing issues with data.
• Broad manufacturing knowledge (machining, sheet metal, welding, polymers) and exposure to additive manufacturing.
• Strong communication and stakeholder management skills; ability to influence across teams and drive decisions in design/program reviews.

Our commitment

We believe it is important for every person to feel valued, included, and empowered to achieve their full potential. By bringing unique individuals and viewpoints together, we achieve extraordinary results.

Lam Research ("Lam" or the "Company") is an equal opportunity employer. Lam is committed to and reaffirms support of equal opportunity in employment and non-discrimination in employment policies, practices and procedures on the basis of race, religious creed, color, national origin, ancestry, physical disability, mental disability, medical condition, genetic information, marital status, sex (including pregnancy, childbirth and related medical conditions), gender, gender identity, gender expression, age, sexual orientation, or military and veteran status or any other category protected by applicable federal, state, or local laws. It is the Company's intention to comply with all applicable laws and regulations. Company policy prohibits unlawful discrimination against applicants or employees.

Lam offers a variety of work location models based on the needs of each role. Our hybrid roles combine the benefits of on-site collaboration with colleagues and the flexibility to work remotely and fall into two categories – On-site Flex and Virtual Flex. ‘On-site Flex’ you’ll work 3+ days per week on-site at a Lam or customer/supplier location, with the opportunity to work remotely for the balance of the week. ‘Virtual Flex’ you’ll work 1-2 days per week on-site at a Lam or customer/supplier location, and remotely the rest of the time.

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