Lead Engineer - PCB Design

Eaton Corporation; Hadapsar; On-site; INR 4,000,000 - 7,000,000; Full time

Job summary

Eaton Corporation in India is seeking a Lead PCB Design Engineer to lead end-to-end PCB development for data center power, thermal management, and high-voltage applications. You will drive design standardization, work with cross-functional teams, and ensure manufacturability and reliability of complex multi-layer PCBs.

The role requires deep expertise in high-power and high-speed PCB technologies, strong leadership, and the ability to deliver innovative, cost-effective solutions within global

Qualifications

• 12–14 years PCB design experience in power electronics or thermal management products.
• Expert knowledge of multi-layer PCB design using Altium Designer, Cadence Allegro, or equivalent EDA tools.
• Strong experience in High Power, Flex, Rigid Flex & HDI PCBs.
• High-speed interfaces (DDR, PCIe, Ethernet, USB, SerDes)
• Power electronics and power conversion systems
• Creepage clearance and safety requirements
• SI/PI analysis and simulation
• Thermal-aware PCB design
• DFM, DFA, and DFT methodologies

Responsibilities

• Lead end-to-end PCB development from concept, schematic review, layout, validation, and production release.
• Mentor PCB designers and provide technical leadership across global engineering teams.
• Collaborate with electrical, mechanical, thermal, firmware, manufacturing, and test teams to optimize product performance.
• Support design reviews, prototype builds, debugging, root-cause analysis, qualification testing, and certification activities.
• Drive PCB design standardization, library management, and design automation.

Skills

PCB design leadership

High voltage PCBs

Power electronics

Signal integrity

Education

Bachelor's Degree in Electronics / Electronics and Communication / Electrical Engineering

Tools

Altium Designer

Cadence Allegro

CAM350

Job description

What you’ll do:

Eaton announced, on June 11, 2026, the intent to combine its Mobility Group (including both the Vehicle and eMobility segments) with a new company. We expect to complete this process by the end of the first half of 2027. The compensation and benefits that will initially be offered for this position are based on Eaton's plans, programs and practices. If you are offered and accept this position and are actively employed by the Mobility Group when the transaction closes, the new company will provide further details to employees concerning compensation and benefits at that time.

The Lead PCB Design Engineer is responsible for leading the design, development, and optimization of printed circuit board (PCB) solutions for electronic products. This role ensures high-quality, manufacturable, and reliable PCB designs, drives design standardization and process improvements, provides technical leadership, and collaborates with cross-functional teams to deliver innovative and cost-effective products.

• Lead end-to-end PCB development from concept, schematic review, layout, validation, and production release.
• Able to lead Program with multiple PCBs and deliver with help of one or more resources
• Design complex multi-layer PCBs for:
  • Data center power distribution and management systems
  • Thermal management and cooling control systems
  • Know-how of OCP Rack and its structure
  • Hands-on experience in High Voltage, High Current PCBs

Develop PCB solutions considering:

• Signal Integrity (SI)
• Power Integrity (PI)
• EMC/EMI compliance
• Thermal performance
• Reliability and Manufacturability

• Define stack-ups, controlled impedance requirements, high-current power routing, grounding strategies, and power distribution networks.
• Collaborate with electrical, mechanical, thermal, firmware, manufacturing, and test teams to optimize overall product performance.
• Support design reviews, prototype builds, debugging, root-cause analysis, qualification testing, and certification activities.
• Drive PCB design standardization, library management, design automation, and continuous improvement initiatives.
• Mentor PCB designers and provide technical leadership across global engineering teams.

Qualifications:

Required: Bachelor’s Degree in Electronics / Electronics and Communication / Electrical Engineering.

• 12–14 years of PCB design experience in power electronics or thermal management products.

Skills:

• Expert knowledge of multi-layer PCB design using Altium Designer, Cadence Allegro, or equivalent EDA tools.

Required:

Strong experience in below:

• Experience with High Power, Flex, Rigid Flex & HDI PCBS.
• High-speed interfaces (DDR, PCIe, Ethernet, USB, SerDes)
• Power electronics and power conversion systems
• Creepage clearance and safety requirements
• SI/PI analysis and simulation
• Thermal-aware PCB design
• DFM, DFA, and DFT methodologies

Well versed with Data Center Rack Architectures, including rack-level power distribution, monitoring, control systems, AI/HPC infrastructure, and cooling solutions.

Good understanding of thermal management technologies including air-cooled and liquid-cooled systems used in modern data centers.

Able to do Power Integrity or Signal Integrity Simulations will be added advantage

Standards & Compliance:

• IPC Standards: IPC-2221/2222, IPC-7351, IPC-A-600, IPC-A-610, IPC-6012, IPC-2152 etc.
• Safety & Regulatory Standards: UL, CSA, IEC 62368-1, IEC 61010, IEC 60664, CE, EMC/EMI, RoHS, and REACH

Desired:

• Experience supporting product certification, safety reviews, and regulatory compliance activities is preferred.

Special:

• CAM validation, check and basic editing of Gerber data using CAM350.

• Strong leadership, communication, and problem-solving skills.
• Ability to work effectively in cross-functional and global engineering environments.