Embedded Software Technical Lead

Mulya Technologies; Hyderabad; On-site; INR 800,000 - 1,600,000; Full time

Job summary

Kandou AI in Hyderabad, India seeks an Embedded Software Technical Lead to drive real-time firmware across high-speed heterogeneous SoCs. You will stay hands-on in C/C++ development while guiding a team through bring-up, validation and release. The role demands RTOS expertise, RISC-V knowledge, and strong debugging skills.

Lead module design, code reviews and coordination with validation teams. Mentorship and architectural alignment are key aspects of this leadership position.

Qualifications

• 10+ years of experience in real-time embedded firmware development.
• Proven ownership of firmware module delivery from requirements to release.
• Experience with bare-metal and RTOS environments on SoC platforms.
• Knowledge of RISC-V architecture and RV32/RV64 cores.
• Hands-on in C/C++ with debugging, bring-up and validation.
• Experience with JTAG, SPI, I2C/I3C interfaces and bootloader flows.
• Proficiency in Python and tooling (Git/GitLab, CI, Make/CMake).

Responsibilities

• Lead design, development, test and maintenance of real-time firmware modules for high-speed SoCs.
• Translate system requirements into module designs and interfaces; review changes with Architects.
• Plan and coordinate work: estimate effort, track milestones, manage risks.
• Hands-on in C/C++ development, RTOS integration, drivers and secure firmware updates.
• Drive bring-up and hardware/software integration; perform root-cause analysis.
• Lead module design reviews and ensure compliance with coding and testing standards.
• Mentor engineers and align decisions with Firmware Lead.
• Collaborate with validation and applications teams to resolve issues.

Skills

C/C++ development

RTOS experience

RISC-V familiarity

Firmware bring-up

Module design

Code reviews

Python scripting

Git/GitLab

CI / Testing

Tools

Zephyr RTOS

FreeRTOS

JTAG

SPI/I2C/I3C

Bootloaders & Secure boot

HyperBus/HyperRAM

Binutils/Toolchain setup

Job description

https://www.thecube.net/events/nyse/ai-factory-data-center-of-the-future/content/Videos/d1ad8af3-1424-4336-a9b3-1d02b5a354b4

we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.

Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.

our architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.

Join Us at Kandou AI

Challenges are our drive, innovation our calling. We at Kandou are a team of passionate accomplished professionals making a mark in the semiconductor industry. We're an innovative leader in high-speed and energy efficient chip-chip link solutions critical to the evolution of the electronics industry, continuously developing to meet the demands of not just the customers of today, but of tomorrow too. If you love to be part of a high-tech scale-up and are motivated by pushing your limits and challenging the status quo, we have an opportunity for you.

As Embedded Software Technical Lead, you will lead the implementation and delivery of assigned firmware modules and workstreams for Kandou's new ASIC products, under the technical direction of the overall Firmware Lead. You will remain hands-on in coding, debugging and bring-up, while mentoring engineers working on your scope. The overall Firmware Lead owns the firmware roadmap, team-wide priorities and release decisions; this role owns execution within the agreed architecture and project plan.

Responsibilities

• Lead the design, development, test and maintenance of assigned real-time firmware modules for high-speed heterogeneous SoC platforms.
• Translate agreed system requirements into module designs and hardware/software interfaces; review architecture and interface changes with the Firmware Lead and architects.
• Plan and coordinate assigned work: estimate effort, track dependencies and milestones, and elevate risks and priority conflicts to the Firmware Lead.
• Remain hands-on in C/C++ development, RTOS integration, low-level drivers, bootloaders, secure boot and reliable firmware updates.
• Drive bring-up, hardware/software integration and root-cause analysis for assigned firmware, working with silicon design and validation teams.
• Lead module-level design and code reviews, apply team coding and test standards, and provide validation evidence and documentation for firmware release reviews.
• Mentor engineers on assigned work, guide implementation decisions and share knowledge; align broader technical decisions with the Firmware Lead.
• Coordinate with validation and applications teams to resolve integration and field issues; improve the software tools supporting silicon development and debug.

Embedded Software Technical Lead Hyderabad, India

• 10+ years of experience designing, coding and debugging real-time embedded applications in C and/or C++, including 2+ years providing technical leadership for firmware modules or projects.
• Demonstrated ownership of firmware module delivery from requirements and design through bring-up, validation and release integration within a wider engineering team.
• Strong embedded SoC experience with bare-metal and RTOS environments, including RTOS porting and integration with Zephyr, FreeRTOS or equivalent.
• Knowledge of RISC-V architecture and hands-on bare-metal or RTOS firmware development for RV32/RV64 cores, including trap handling, CSR access and toolchain setup.
• Board and SoC bring-up using JTAG and other debug mechanisms; ability to diagnose complex issues across firmware, drivers and hardware.
• Experience interfacing with hardware and peripherals using SPI, I2C/SMBus, I3C and JTAG, and implementing bootloaders, secure boot and firmware update flows.
• Proficiency in Python or another modern scripting language, and practical use of Git/GitLab, CI, Make/CMake and automated unit and integration testing.
• Strong design-review, documentation, organisational, presentation and mentoring skills; ability to align cross-functional teams and learn new technical areas.

Useful Experience

• Heterogeneous multicore systems with scalar and vector processors; embedded Linux, memory and network interfaces, and virtual memory.
• High-speed signalling technologies such as PCIe and CXL, including link training, equalization and retimer/redriver interaction with host and device PHYs.
• Firmware for Active Electrical Cable (AEC) or retimer/redriver ASICs, including cable diagnostics, eye margin monitoring, temperature/voltage telemetry and power-state management.
• Management and sideband protocols including SMBus, I3C, MCTP and CMIS; SerDes technology and PHY register-level tuning.
• Simulation, co-simulation and FPGA platforms for pre-silicon firmware development; HyperBus and HyperRAM technologies.
• Cryptographic algorithms and secure firmware lifecycle practices, including authenticated updates, recovery and rollback protection.