Design for Manufacturing (DFM) Engineer - PCBA

Apple Inc.

Bengaluru

On-site

INR 1,500,000 - 2,300,000

Full time

14 days+

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Job summary

Apple Inc. in Bengaluru, India, invites an experienced Design for Manufacturing (DFM) Engineer for PCBA to join our Operations and Supply Chain team.

You will lead development and ramp for next‑generation Apple products, guiding CM partners and driving manufacturability from concept through high‑volume production. The role emphasizes improving PCBA manufacturing processes, testing, and quality, with significant travel to supplier sites.

Qualifications

  • BS/MS in Mechanical, Electrical, Industrial, Chemical or Manufacturing Engineering with 5 to 6 years experience working in Printed circuit board assembly or with surface mount technology at a contract manufacturer or any related experience.
  • 5+ years of experience in printed circuit assembly manufacturing processes.
  • Surface mount technology process knowledge including stencil printing, pick and placement process, reflow process, hotbar, robotic/laser soldering and ACF process.
  • Travel domestically and internationally to supplier sites - 60%

Responsibilities

  • Attend development builds as required under direction of Operations Engineering DRI.
  • Provide guidance and resources to contract manufacturing (CM) partner engineers.
  • Act as project leader on a variety of complex projects.
  • Plan, develop and implement technically complex procedures for PCBA manufacturing process, rework, and testing.
  • Make recommendations for changes required in testing equipment (ICT and Functional test), manufacturing processes, and new testing requirements.
  • Design and develop technically complex new processes to improve quality and efficiency.
  • Provide early manufacturing involvement to ensure new products are manufacturable. Activities include driving out costs in design/PCBA manufacturing tooling, influencing designs so that they are manufacturable, reducing complexity by using standard size packaging.
  • Interface with Apple PCBA Subcontractors/JDM partner adherence to Process Parameters and Procedures as well as approved Manufacturing and Test processes. Ensure maintenance of specified quality levels at PCBA Manufacturing sites.

Skills

PCBA DFM
Project leadership
SMT processes
Process optimization

Education

Bachelors/Masters in Mechanical, Electrical, Industrial, Chemical or Manufacturing Engineering

Tools

ICT equipment

Job description

Design for Manufacturing (DFM) Engineer - PCBA

Bengaluru, Karnataka, India Operations and Supply Chain

Imagine what you could do here. At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish.The people here at Apple don’t just create products - they create the kind of wonder that’s revolutionized entire industries. It’s the diversity of those people and their ideas that inspires the innovation that runs through everything we do, from amazing technology to industry-leading environmental efforts. Join Apple, and help us leave the world better than we found it.Apple products are as beautiful on the inside as they are on the outside. Inside every one of our products, are some of the world's most challenging consumer PCBA and Flex designs. Imagine yourself as a select member of the team that brings these assemblies from concept to high volume manufacturing.

Description

In this highly visible role, you will have the opportunity to make a significant impact on Apple Products, and leave a footprint for years to come. We have an opportunity for an accomplished PCBA DFM engineer to lead the development, and ramp for a next generation Apple product.Our PCBA DFM engineering team enables the mass creation of impossible products as a partner in the development of Apple's renowned designs.

Responsibilities
  • Attend development builds as required under direction of Operations Engineering Directly Responsible Individual (DRI)
  • Provide guidance and resources to contract manufacturing (CM) partner engineers
  • Act as project leader on a variety of complex projects
  • Plan, develop and implement technically complex procedures for PCBA manufacturing process, rework, and testing
  • Make recommendations for changes required in testing equipment (ICT and Functional test), manufacturing processes, and new testing requirements
  • Design and develop technically complex new processes to improve quality and efficiency
  • Provide early manufacturing involvement to ensure new products are manufacturable. Activities include driving out costs in design/PCBA manufacturing tooling, influencing designs so that they are manufacturable, reducing complexity by using standard size packaging.
  • Interface with Apple Printed Circuit Board Assembly (PCBA) Subcontractor and manage technical aspects of Volume Manufacturing builds including rework processes, with direction as necessary from Operations Engineering DRI
  • Ensure Apple PCBA Subcontractors/JDM partner adherence to Process Parameters and Procedures as well as approved Manufacturing and Test processes. Ensure maintenance of specified quality levels at PCBA Manufacturing sites
Minimum Qualifications
  • BS/MS in Mechanical, Electrical, Industrial, Chemical or Manufacturing Engineering with 5 to 6 years experience working in Printed circuit board assembly or with surface mount technology at a contract manufacturer or any related experience.
  • 5+ years of experience in printed circuit assembly manufacturing processes.
  • Surface mount technology process knowledge including stencil printing, pick and placement process, reflow process, hotbar, robotic/laser soldering and ACF process.
  • Experience developing process quality plans, supplier quality audits, and driving corrective actions and failure analysis efforts.
  • Travel domestically and internationally to supplier sites - 60%
Preferred Qualifications
  • Working knowledge of printed circuit board assembly (PCBA) reliability concepts, failure analysis techniques like EDX, SEM and FTIR.
  • Experience with the development and evaluation of various SMT processes
  • Project management experience and a deep understanding of problem solving tools including design of experiments, root cause analysis and statistical analytical tools
  • Experience with any of the following: packaging technology, chip scale or wafer level chip scale packaging technology, molding process, System in package construction
  • Effective communication skills with an ability to explain complex problems to a wide variety of technical and non-technical audiences
  • Good team player with an ability to work with multiple x-functional teams

At Apple, we believe accessibility is a fundamental human right. You’ll find that idea reflected in everything here - in our culture, our benefits and our digital tools. By welcoming as many perspectives as possible, we help you build a career where you feel like you belong. Learn about accessibility in Apple’s workplace

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