Android Product Integration Engineer | Qualcomm | Hyderabad

Qualcomm

Hyderabad

Presencial

INR 1.500.000 - 2.600.000

Jornada completa

Hace 11 días

Una candidatura completa en un minuto

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Descripción de la vacante

Qualcomm Hyderabad is seeking an experienced Android Product Integration Engineer with 6–9 years of software engineering to lead BSP/AOSP integrations, manage build pipelines, and debug low-level system software.

You will collaborate with hardware and modem teams, optimize kernel drivers, and ensure CTS/VTS compliance, with on-site operations in Hyderabad.

Formación

  • Bachelor's or Master's degree in a technical field and 6–9 years of embedded software/Android BSP/AOSP experience.
  • Proven expertise in Android BSP, AOSP architecture, HALs, and framework integration.
  • Strong C/C++ and Python development, Linux kernel internals, and driver experience.

Responsabilidades

  • Lead end-to-end Android BSP/AOSP development, porting, and integration.
  • Configure and maintain embedded Linux build environments and Makefiles.
  • Develop system software, drivers, and automation tools in C, C++, Python.
  • Perform firmware flashing, performance profiling, and board-level debugging.
  • Diagnose crash dumps, kernel panics, bootloader failures, and driver issues.
  • Collaborate with hardware, modem firmware, and software QA teams for releases.
  • Ensure CTS and VTS compliance with documentation and test runs.
  • Maintain runbooks, build configs, and version control logs.

Conocimientos

Android BSP
AOSP
Linux kernel
C/C++
Python
Embedded systems
Git
Debugging
Cross-functional

Educación

Bachelor's or Master's in CS/ECOM/SE

Herramientas

Git
Make/Soong
GN
JTAG
Lauterbach

Descripción del empleo

Position Summary

Qualcomm is actively seeking an experienced, high-caliber, and technical Android Product Integration Engineer with 6 to 9 years of professional software engineering experience to join our connectivity and mobile solutions team in Hyderabad on a full-time permanent basis. In this critical product engineering role, you will be responsible for leading complex Android BSP and AOSP integrations, managing operating system build pipelines, and debugging low-level system software issues. You will leverage your strong background in Linux kernel development, C/C++ and Python programming, and embedded systems architecture to deliver uncompromised device performance and connectivity. This opportunity offers competitive compensation, executive technical visibility, and exceptional career growth prospects within a premier global wireless semiconductor and technology enterprise.

Detailed Job Description

As an Android Product Integration Engineer supporting cutting-edge wireless and connectivity platforms in Hyderabad via Qualcomm, you will take full operational, tactical, and technical ownership of Android Board Support Package (BSP) development, Android Open Source Project (AOSP) customizations, and system integration workflows. Your day-to-day responsibilities include building, integrating, and debugging custom Android firmware images, optimizing Linux kernel drivers, and authoring automation scripts in Python and C/C++. You will collaborate closely with hardware design teams, modem software squads, and global product engineering divisions to resolve complex integration anomalies. Furthermore, you will manage application requirements via direct email to Vaishnavi Nair at vparamba@qti.qualcomm.com, ensuring strict compliance with Qualcomm’s high engineering standards and project milestones.

Key Responsibilities
  • Lead end-to-end Android Board Support Package (BSP) and Android Open Source Project (AOSP) development, porting, and integration.
  • Configure, build, and maintain complex embedded Linux operating system build environments and makefiles.
  • Develop robust system software, drivers, and automation utilities using C, C++, and Python programming languages.
  • Execute rigorous system integration, firmware flashing, performance profiling, and board-level debugging.
  • Diagnose and resolve complex crash dumps, kernel panics, bootloader failures, and driver concurrency issues.
  • Collaborate cross-functional with hardware engineers, modem firmware teams, and software QA squads to ensure flawless product releases.
  • Ensure strict compliance with Android Compatibility Test Suite (CTS) and Vendor Test Suite (VTS) requirements.
  • Maintain meticulous technical documentation, integration runbooks, build configurations, and version control logs.
Required Qualifications & Skills
  • Bachelor’s or Master’s degree in Computer Science, Electronics Engineering, Telecommunications, Software Engineering, or a related technical discipline.
  • Minimum of 6 to 9 years of progressive professional experience in embedded software development, Android BSP, or AOSP engineering.
  • Deep specialist expertise in Android BSP, AOSP architecture, HAL development, and framework integration.
  • Strong practical proficiency in Linux kernel internals, device drivers, and system-level C, C++ and Python development.
  • Proven hands‑on experience with build systems, source control (Git), and complex compilation pipelines (Makefile, Soong, GN).
  • Extensive experience with debugging tools (GDB, Lauterbach, JTAG, systrace, logcat) and crash dump analysis.
  • Excellent analytical, complex problem‑solving, and cross‑functional communication skills.
  • Mandatory legal eligibility to work in India with local residency and availability for on‑site operations in Hyderabad.
Nice-to-Have Skills
  • Prior professional working experience in tier‑1 mobile chipset manufacturers, smartphone OEMs, or wireless R&D centers.
  • Familiarity with Qualcomm Snapdragon hardware platforms, chipset architecture, and QPST/QXDM diagnostic tools.
  • Advanced knowledge of secure boot, TrustZone (TEE), and Android security hardening.
  • Experience with continuous integration (CI) pipelines for automated embedded firmware builds and testing.
Application Information
  • Recruiter: Qualcomm Human Resources Division
  • Contact Name: Vaishnavi Nair (Sr. Talent Acquisition Specialist)
  • Email: vparamba@qti.qualcomm.com
  • Phone:
  • Company Website: https://www.qualcomm.com
  • Salary/Rate: Market Competitive / Global Semiconductor Package
  • Deadline: Open until filled (Urgent Hyderabad On‑Site Opening)
  • Notice Period: Immediate to 30 Days
  • Contract Duration: Permanent / Full‑Time On‑Site (Hyderabad, India)
Recruitment Pro Tip

When applying for this Android Product Integration Engineer position at Qualcomm, ensure your resume explicitly highlights your AOSP/BSP experience, your C/C++/Python embedded background, and your hands‑on debugging proficiency.

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