Module Engineer, Wafer Packaging (Hybrid)

Intel Corporation; Leixlip; Hybrid; EUR 49,000 - 77,000; Full time

Benefits offered by this job

25 days annual leave

Healthcare and pension

Bonuses and stock

Job summary

Intel Corporation in Leixlip, Ireland, is seeking a Module Engineer to join Wafer Packaging Manufacturing (WPM) C4 Ireland. You will own module performance, sustain processes, and drive improvement in a highly automated fab with a hybrid work model (minimum 4 days on site).

Collaborate across global teams to optimize process capability and tool reliability. The role requires a Level 8 qualification in a STEM field and 1+ years in semiconductor or advanced manufacturing, with experience in data

Qualifications

• Minimum NFQ Level 8 in a STEM discipline.
• 1+ years experience in semiconductor or advanced manufacturing.
• Strong data analysis and problem solving skills.

Responsibilities

• Own module performance across safety, quality, output and equipment metrics.
• Sustain and optimize processes for stable, high quality output.
• Use data methods to reduce variation and strengthen control.
• Lead cross functional problem solving with teams.

Skills

Analytical skills

Problem solving

Collaboration across teams

Education

NFQ Level 8 in Science or Engineering

Bachelor degree in Mechanical, Chemical, Materials, Electrical Eng or Physics

Tools

JMP

SQL

Job description

Intel Corporation in Leixlip, Ireland, is seeking a Module Engineer to join Wafer Packaging Manufacturing (WPM) C4 Ireland. You will own module performance, sustain processes, and drive improvement in a highly automated fab with a hybrid work model (minimum 4 days on site).

Collaborate across global teams to optimize process capability and tool reliability. The role requires a Level 8 qualification in a STEM field and 1+ years in semiconductor or advanced manufacturing, with experience in data