Principal Engineer Process Development

Infineon Technologies AG; Batam; On-site; USD 40.000 - 70.000; Full time

Job summary

Infineon Technologies AG is seeking a technical leader in assembly process development who will engage stakeholders, establish processes, and lead a team for IC products. The ideal candidate will possess a Mechanical/Materials Engineering background, with extensive experience in semiconductor assembly, and a strong capability in problem-solving and team leadership.

Qualifications

• Minimum 7 Years of IC/Semiconductor assembly industry.
• Possess in-depth knowledge in Molding process, equipment, materials.
• Demonstrates an ability to lead a team in problem-solving.

Responsibilities

• Engage stakeholders and align with the Package/Process Roadmap.
• Establish mold process for new IC products.
• Lead, coach and develop competency of the process development team.

Skills

Communication

Coordination

Problem-solving

Analytical

Initiative

Education

Master / Bachelor Degree in Mechanical/Materials/Process Engineering

Tools

JMP

FMEA

SPC

Job description

Exciting career in R&D and be a technical leader in assembly process development

In your new role you will:

• Engage internal and external stakeholders and align with the big picture or Package/Process Roadmap
• Establish mold process for new IC product which meets product performance and quality
• Proactively work and propose solutions to ensure best in class time to market for Infineon products
• Have an impact on product quality, project cost and timeline
• Lead, coach and continuously develop the competency of the unit process development team at multi sites
• Guide junior engineer in focus team topic/ lead focus team of high complexity and task force.

You are best equipped for this task if you have:

• Education qualification in Master / Bachelor Degree in Mechanical/Materials/Process Engineering
• Minimum 7 Years of IC/Semiconductor assembly industry
• Possess in-depth knowledge in Molding process, equipment, materials, and their interactions
• Independent with good communication and coordination skills
• Demonstrates an ability to lead a team in problem-solving
• Analytical mind and high initiative to challenge him/herself to move the next level of competency
• Knowledgeable in IC Packaging Assembly Process Flow
• Experience in analytical tools (i.e. JMP, 8D, FMEA, SPC, DMAIC approach to problem solving) and design of experiments.

#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?

We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.