Principal Manufacturing Engineer – Subcon, Backend, Assembly

Nexperia; Hong Kong; Presencial; HKD 600.000 - 1.200.000; Jornada completa

Descripción de la vacante

Nexperia is seeking a senior manufacturing engineering professional in Hong Kong to oversee semiconductor assembly and backend production, acting as the technical interface with external subcontractors and serving as the first-level gatekeeper for process changes.

The role emphasizes quality, reliability, risk assessments, NPI support, and driving cost reductions, audits, and performance reporting across subcontractor sites.

Formación

• Bachelor’s degree in Electrical, Electronics, Mechanical Engineering, or related field.
• 10+ years of experience in semiconductor assembly / wafer level / backend manufacturing.
• Strong experience in high-volume and high-mix production environments.
• Good understanding of semiconductor packaging processes and manufacturing flows.
• Project management experience in engineering or manufacturing environments.
• Strong analytical and problem-solving skills.

Responsabilidades

• Act as technical interface between Nexperia and external subcontractor manufacturing sites (assembly / backend production)
• Review and approve process or material changes introduced by subcontractors (first-level technical gatekeeper)
• Support process risk assessments and ensure manufacturing changes meet quality and reliability requirements
• Drive resolution of production issues, yield problems, and quality deviations at subcontractor sites
• Monitor and manage subcontractor performance, including operational and quality KPIs
• Support NPI (New Product Introduction) and industrialization of new packages/processes at subcontractors
• Lead or support cost reduction and value engineering initiatives
• Participate in audits (customer, quality, VDA) and support compliance verification activities
• Support project milestones, technical reviews, and subcontractor performance reporting

Conocimientos

High-volume production

High-mix production

Project management

Analytical problem-solving

Semiconductor packaging processes

Quality assurance

Educación

Bachelor's degree in Electrical Engineering

Bachelor's degree in Electronics Engineering

Bachelor's degree in Mechanical Engineering

Descripción del empleo

Responsibilities

• Act as technical interface between Nexperia and external subcontractor manufacturing sites (assembly / backend production)
• Review and approve process or material changes introduced by subcontractors (first-level technical gatekeeper)
• Support process risk assessments and ensure manufacturing changes meet quality and reliability requirements
• Drive resolution of production issues, yield problems, and quality deviations at subcontractor sites
• Monitor and manage subcontractor performance, including operational and quality KPIs
• Support NPI (New Product Introduction) and industrialization of new packages/processes at subcontractors
• Lead or support cost reduction and value engineering initiatives
• Participate in audits (customer, quality, VDA) and support compliance verification activities
• Support project milestones, technical reviews, and subcontractor performance reporting

Requirements

• Bachelor’s degree in Electrical, Electronics, Mechanical Engineering, or related field
• 10+ years of experience in semiconductor assembly / wafer level / backend manufacturing
• Strong experience in high-volume and high-mix production environments
• Good understanding of semiconductor packaging processes and manufacturing flows
• Project management experience in engineering or manufacturing environments
• Strong analytical and problem-solving skills

Certifications & Qualifications

• Bachelor’s degree in Electrical Engineering
• Bachelor’s degree in Electronics Engineering
• Bachelor’s degree in Mechanical Engineering