Thermal Architect | Datacenter Cooling & AI-Driven Systems

Dell Inc.; Greater London; On-site; GBP 75,000 - 120,000; Full time

Job summary

Dell Technologies in London, United Kingdom is seeking a Thermal Architect to join the Engineering Technologist Team. You will design and optimize cooling solutions for large-scale datacenters, focusing on air and liquid cooling strategies.

You will collaborate with engineers, suppliers and ODMs across regions (US, EMEA, APJ) to define requirements, propose BOMs, and translate customer needs into robust thermal designs for next-generation products.

Qualifications

• Bachelor’s degree or equivalent experience in Mechanical Engineering with emphasis on thermal science, fluid dynamics or heat transfer.
• 7 years of related experience (can be offset with an advanced degree).
• Advanced knowledge of heat transfer, thermal testing, and the use of CAD/CFD/FEA tools to optimize cooling solutions.
• Ability to collaborate with Dell’s technology partners and supply base on cutting edge technology development with ODMs.

Responsibilities

• Productize solution / configuration for datacenter cooling with customers across L10 and L11.
• Define requirements across US, EMEA & APJ customers and incorporate into design.
• Design air and liquid cooling solutions to span different geographical areas.
• Propose BOM/ SKUs to meet technical requirements and shape the offer accordingly.

Skills

Heat transfer analysis

Thermal system design

CFD/CFD tools

CAD/CAE

Thermal testing & measurement

Analytical problem solving

Cross-functional collaboration

Technical communication

Vendor/ODM collaboration

Education

Bachelor’s degree in Mechanical Engineering

Tools

FEA

CAD

CFD

Thermal testing equipment

Job description

Dell Technologies in London, United Kingdom is seeking a Thermal Architect to join the Engineering Technologist Team. You will design and optimize cooling solutions for large-scale datacenters, focusing on air and liquid cooling strategies.

You will collaborate with engineers, suppliers and ODMs across regions (US, EMEA, APJ) to define requirements, propose BOMs, and translate customer needs into robust thermal designs for next-generation products.