Space Systems Lead Electronics Engineer (FPGA/ASIC)

Platform Recruitment; Hyde; Hybrid; GBP 90,000 - 110,000; Full time

Job summary

Platform Recruitment is sourcing a Lead Electronics Engineer for a leading technology organisation in Manchester. The role focuses on leading development of advanced electronics for FPGA and ASIC-based space systems, guiding the full hardware lifecycle from specification to space qualification.

The position requires senior leadership across multidisciplinary teams, with emphasis on high-speed digital design, SerDes interconnects and complex HDI PCB design. Hybrid working arrangement offered.

Qualifications

• Extensive experience in electronic hardware/product design.
• Background in space/defence or other safety-critical industries.
• Strong high-speed digital design and SerDes interconnect experience.
• Experience designing complex multi-layer HDI PCBs.
• Knowledge of FPGA or ASIC-based systems.
• Experience with schematic capture, PCB design and circuit simulation tools.

Responsibilities

• Lead complex electronic hardware development and manufacturing activities.
• Design high-speed digital circuits featuring FPGA, ASIC and SerDes technologies.
• Direct the design of complex multilayer and HDI PCBs.
• Support hardware, software and systems integration, validation and qualification.
• Coordinate internal engineers, PCB layout teams and external manufacturing partners.
• Provide technical leadership and mentoring across multidisciplinary engineering teams.

Skills

High-speed digital design

FPGA/ASIC

HDI PCB design

Schematic capture

Circuit simulation

Technical leadership

Space/Defence domain

Job description

Platform Recruitment is sourcing a Lead Electronics Engineer for a leading technology organisation in Manchester. The role focuses on leading development of advanced electronics for FPGA and ASIC-based space systems, guiding the full hardware lifecycle from specification to space qualification.

The position requires senior leadership across multidisciplinary teams, with emphasis on high-speed digital design, SerDes interconnects and complex HDI PCB design. Hybrid working arrangement offered.