Senior Optical Packaging & Assembly Engineer

PsiQuantum; Warrington; On-site; GBP 55,000 - 75,000; Full time

Job summary

A leading quantum computing company in the UK is seeking a Senior Optical Packaging Engineer to develop high-performance packaging workflows for photonic integrated circuits. Candidates should have a Master's Degree in Optical Engineering or Physics and a minimum of 5 years of experience with optical fibers. Responsibilities include designing optical packages, developing prototypes, and collaborating with suppliers. This is an opportunity to contribute to innovative quantum computing solutions.

Qualifications

• 3+ years of experience working on PIC packaging design & qualification.
• 5+ years of experience working with optical fibers.
• Experience with optical data analysis.

Responsibilities

• Develop an optical package and fibre-to-chip alignment scheme.
• Help develop packaging prototypes & scalable packaging flows.
• Work with supply chain on procuring parts needed for assembly.

Skills

Optical packaging design

Fibre-to-chip alignment

Optical measurements

Education

Master's Degree in Optical Engineering or Physics

Job description

Quantum computing holds the promise of humanity's mastery over the natural world, but only if we can build a real quantum computer. PsiQuantum is on a mission to build the first real, useful quantum computers, capable of delivering the world-changing applications that the technology has long promised. We know that means we will need to build a system with roughly 1 million qubits that supports fault tolerant error correction within a scalable architecture, and a data center footprint.

By harnessing the laws of quantum physics, quantum computers can provide exponential performance increases over today's most powerful supercomputers, offering the potential for extraordinary advances across a broad range of industries including climate, energy, healthcare, pharmaceuticals, finance, agriculture, transportation, materials design, and many more.

PsiQuantum has determined the fastest path to delivering a useful quantum computer, years earlier than the rest of the industry. Our architecture is based on silicon photonics which gives us the ability to produce our components at Tier-1 semiconductor fabs such as GlobalFoundries where we leverage high-volume semiconductor manufacturing processes, the same processes that are already producing billions of chips for telecom and consumer electronics applications. We also benefit from the quantum mechanics reality that photons don't feel heat or electromagnetic interference, allowing us to take advantage of existing cryogenic cooling systems and industry standard fiber connectivity.

In 2024, PsiQuantum announced two government-funded projects to support the build-out of our first Quantum Data Centers and utility-scale quantum computers in Brisbane, Australia and Chicago, Illinois. Both projects are backed by nations that understand quantum computing's potential impact and the need to scale this technology to unlock that potential. And we won't just be building the hardware, but also the fault tolerant quantum applications that will provide industry-transforming results.

Quantum computing is not just an evolution of the decades-old advancement in compute power. It provides the key to mastering our future, not merely discovering it. The potential is enormous, and we have the plan to make it real. Come join us.

There's much more work to be done and we are looking for exceptional talent to join us on this extraordinary journey!

Job Summary:

The Senior Optical Packaging Engineer is responsible for developing & implementing high-performance, robust & scalable opto-electronic packaging workflows for a variety of chip-based photonic integrated circuits. This work will be carried out in PsiQuantum's UK R&D facility located in Daresbury Lab.

Responsibilities:

• Develop an optical package and fibre-to-chip alignment scheme that allows for high alignment accuracy and scalable assembly.
• Help develop packaging prototypes & scalable fibre-to-chip packaging flows and processes.
• Review packaging design BOMs, work with supply chain on procuring parts needed for assembly.
• Work with our internal packaging team and external vendors on transferring & scaling packaging designs and processes based on successful prototypes.
• Work with external vendors and suppliers to source required materials and provide feedback on evolving requirements.
• Working with external partners to develop advanced opto-electronic packaging solutions.

Experience/Qualifications:

• Master's Degree or above in Optical Engineering, Physics or equivalent.
• 3+ years of experience working on PIC packaging design & qualification.
• 5+ years of experience working with optical fibers, optical measurements.
• 3+ years of experience working on FAU / optical connector to chip attachment.
• Experience with optical data analysis.

PsiQuantum provides equal employment opportunity for all applicants and employees. PsiQuantum does not unlawfully discriminate on the basis of race, color, religion, sex (including pregnancy, childbirth, or related medical conditions), gender identity, gender expression, national origin, ancestry, citizenship, age, physical or mental disability, military or veteran status, marital status, domestic partner status, sexual orientation, genetic information, or any other basis protected by applicable laws.

Note: PsiQuantum will only reach out to you using an official PsiQuantum email address and will never ask you for bank account information as part of the interview process. Please report any suspicious activity to [e-mail]

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