Senior Hardware Enigneer

IC Resources; Oxford; On-site; GBP 90,000 - 110,000; Full time

Benefits offered by this job

Life assurance

Income protection insurance

Electric vehicle scheme

Cycle to Work scheme

Learning and development opportunities

Cutting-edge technology projects

Full product lifecycle exposure

Job summary

IC Resources is seeking a Senior HW Engineer - PCB Layout to join a growing deep-tech engineering team developing advanced computing and high-performance electronic systems in Oxford, UK. You will own PCB layout from schematic handoff to manufacturing release and collaborate with hardware, signal integrity, and mechanical engineers.

Responsibilities include developing stack-ups, impedance control, differential routing, BGA placement for large FPGAs/ASICs, and creating manufacturing outputs.

Qualifications

• Extensive PCB layout experience on complex, high-speed electronic products.
• Strong experience with Cadence Allegro or Altium Designer.

Responsibilities

• Own PCB layout activities from schematic handoff through to fabrication release.
• Develop stack-ups and HDI structures for complex electronic systems.
• Implement controlled impedance routing, differential pairs, length matching and phase matching requirements.
• Support BGA breakout and placement for large FPGAs, ASICs and fine-pitch devices.
• Translate SI/PI requirements into practical layout constraints.
• Work closely with hardware, mechanical and manufacturing teams to optimise design performance and manufacturability.
• Produce manufacturing outputs including Gerber files, ODB++, drill files, fabrication notes and assembly documentation.
• Lead DFM, DFA and DFT reviews.
• Act as the primary technical contact for PCB fabricators and assembly partners.
• Manage PCB libraries, CAD standards, footprints and design templates.
• Support product development from early prototypes through to volume manufacture.
• Extensive PCB layout experience on complex, high-speed electronic products.
• Knowledge of FPGA-based hardware platforms.
• Experience with RF, microwave or mixed-signal PCB design.
• Experience with rigid-flex PCB technology.
• Thermal management and mechanical integration experience.
• Experience creating PCB libraries, design standards and CAD processes.

Skills

PCB layout

HDI stack-ups

Impedance control

Differential routing

Length matching

Phase matching

BGA placement

Gerber/ODB++ outputs

DFM/DFT

Allegro/Altium

Tools

Cadence Allegro

Altium Designer

Job description

We are looking for a Senior HW Engineer - PCB Layout to join a growing deep-tech engineering team developing advanced computing and high-performance electronic systems.

The Senior HW Engineer - PCB Layout will take ownership of complex PCB layouts, working closely with hardware, signal integrity and mechanical engineers.

The Senior HW Engineer - PCB Layout will play a key role in taking products from schematic capture through to manufacturing release.

What the Role Entails

• Own PCB layout activities from schematic handoff through to fabrication release.
• Develop stack-ups and HDI structures for complex electronic systems.
• Implement controlled impedance routing, differential pairs, length matching and phase matching requirements.
• Support BGA breakout and placement for large FPGAs, ASICs and fine-pitch devices.
• Translate SI/PI requirements into practical layout constraints.
• Work closely with hardware, mechanical and manufacturing teams to optimise design performance and manufacturability.
• Produce manufacturing outputs including Gerber files, ODB++, drill files, fabrication notes and assembly documentation.
• Lead DFM, DFA and DFT reviews.
• Act as the primary technical contact for PCB fabricators and assembly partners.
• Manage PCB libraries, CAD standards, footprints and design templates.
• Support product development from early prototypes through to volume manufacture.
• Extensive PCB layout experience on complex, high-speed electronic products.
• Strong experience with Cadence Allegro or Altium Designer.
• Experience designing HDI PCBs using technologies such as:
• Via-in-pad
• Stacked or staggered vias
• Back-drilling
• Experience with BGA breakout and placement of large, fine-pitch devices including FPGAs and ASICs.
• Strong understanding of high-speed design practices including:
• Controlled impedance routing
• Length matching
• Signal integrity considerations
• Knowledge of IPC standards and PCB manufacturing requirements.
• Experience generating complete manufacturing documentation and release packages.
• Understanding of DFM, DFA and DFT principles.
• Experience with ultra-high-speed digital interfaces.
• Knowledge of FPGA-based hardware platforms.
• Experience with RF, microwave or mixed-signal PCB design.
• Experience with rigid-flex PCB technology.
• Thermal management and mechanical integration experience.
• Experience creating PCB libraries, design standards and CAD processes.
• Background working in high-performance computing, telecommunications, aerospace, defence or advanced technology sectors.
• Life assurance.
• Income protection insurance.
• Electric vehicle scheme.
• Cycle to Work scheme.
• Learning and development opportunities.
• Opportunity to work on cutting-edge technology products.
• Exposure to the full product lifecycle from concept through to production.