RF Assembly Engineer — NPI & Production (Cambridge)

Forefront RF; Cambridge; On-site; GBP 42,000 - 65,000; Full time

Benefits offered by this job

Company Share Option Scheme

25 days holiday + bank holidays

Weekly company lunches

Flexible work hours and remote work

Job summary

Forefront RF, a Cambridge-based fabless semiconductor company, is seeking an Assembly Engineer to drive assembly and packaging activities from prototype through volume production. You will work with design, test, operations, suppliers and manufacturing partners to deliver scalable, high-quality packaging solutions for next-generation RF products.

Ideal candidates have a degree in Electronic/Manufacturing Engineering, experience in semiconductor packaging, and strong problem-solving skills to

Qualifications

• Degree in Electronic/Manufacturing Engineering or similar.
• Experience in semiconductor assembly, packaging, or manufacturing engineering.
• Understanding of packaging and assembly processes.
• Familiarity with OSATs and outsourced semiconductor manufacturing.
• Experience improving yield and performing failure analysis.

Responsibilities

• Manage assembly activities across prototype and production builds.
• Collaborate with OSATs and partners on package assembly and process development.
• Support NPI and manufacturing readiness activities.
• Drive yield improvement and root-cause analysis for assembly issues.
• Coordinate reliability testing, qualification and failure analysis.
• Collaborate with design/test/product teams to optimise manufacturability.
• Create and maintain assembly docs, flows and specs.
• Identify continuous improvement across quality, cost and efficiency.

Skills

Problem solving

Analytical thinking

Team collaboration

Attention to detail

Education

Degree in Electronic Engineering

Manufacturing Engineering

Materials Science

Tools

OSAT interactions

Job description

Forefront RF, a Cambridge-based fabless semiconductor company, is seeking an Assembly Engineer to drive assembly and packaging activities from prototype through volume production. You will work with design, test, operations, suppliers and manufacturing partners to deliver scalable, high-quality packaging solutions for next-generation RF products.

Ideal candidates have a degree in Electronic/Manufacturing Engineering, experience in semiconductor packaging, and strong problem-solving skills to