RF Assembly Engineer — NPI/Packaging | Flexible Hours Remote

Forefront RF; Cambridge; On-site; GBP 55,000 - 75,000; Full time

Benefits offered by this job

Competitive salary and pension

Company Share Option Scheme

25 days holiday + bank holidays

Weekly company lunches

Flexible work hours and remote work

Private medical insurance

Life assurance x 4

Income protection

Healthshield Cash plan

Heka flexible benefits platform

Job summary

Forefront RF in Cambridge, UK, is seeking an Assembly Engineer to drive assembly and packaging activities for RF semiconductor products as the business scales. You will collaborate with design, test, operations, suppliers, and manufacturing partners to deliver robust, scalable packaging solutions from prototype to volume production.

The role requires experience in semiconductor assembly/packaging, strong problem-solving and communication skills, and a proactive approach to continuous

Qualifications

• Degree in Electronic Engineering, Materials Science, Manufacturing Engineering, or similar.
• Experience in semiconductor assembly, packaging, or manufacturing engineering.
• Understanding of semiconductor packaging and assembly processes.
• Familiarity with OSATs and outsourced semiconductor manufacturing.
• Experience with yield improvement, failure analysis, and process optimisation.

Responsibilities

• Manage semiconductor assembly activities across prototype and production builds
• Work with OSAT and manufacturing partners on package assembly and process development
• Support new product introduction and manufacturing readiness activities
• Drive yield improvement and root-cause analysis for assembly-related issues
• Coordinate reliability testing, qualification, and failure analysis activities
• Collaborate with design, test, and product engineering teams to optimise manufacturability
• Create and maintain assembly documentation, process flows, and manufacturing specifications
• Identify continuous improvement opportunities across quality, cost, and production efficiency

Skills

Problem-solving

Analytical thinking

Communication

Teamwork

Attention to detail

Education

Electronic Engineering degree

Materials Science degree

Manufacturing Engineering degree

Tools

OSATs

Job description

Forefront RF in Cambridge, UK, is seeking an Assembly Engineer to drive assembly and packaging activities for RF semiconductor products as the business scales. You will collaborate with design, test, operations, suppliers, and manufacturing partners to deliver robust, scalable packaging solutions from prototype to volume production.

The role requires experience in semiconductor assembly/packaging, strong problem-solving and communication skills, and a proactive approach to continuous