Assembly Engineer

Forefront RF; Cambridge; On-site; GBP 55,000 - 75,000; Full time

Benefits offered by this job

Competitive salary and pension

Company Share Option Scheme

25 days holiday + bank holidays

Weekly company lunches

Flexible work hours and remote work

Private medical insurance

Life assurance x 4

Income protection

Healthshield Cash plan

Heka flexible benefits platform

Job summary

Forefront RF in Cambridge, UK, is seeking an Assembly Engineer to drive assembly and packaging activities for RF semiconductor products as the business scales. You will collaborate with design, test, operations, suppliers, and manufacturing partners to deliver robust, scalable packaging solutions from prototype to volume production.

The role requires experience in semiconductor assembly/packaging, strong problem-solving and communication skills, and a proactive approach to continuous

Qualifications

• Degree in Electronic Engineering, Materials Science, Manufacturing Engineering, or similar.
• Experience in semiconductor assembly, packaging, or manufacturing engineering.
• Understanding of semiconductor packaging and assembly processes.
• Familiarity with OSATs and outsourced semiconductor manufacturing.
• Experience with yield improvement, failure analysis, and process optimisation.

Responsibilities

• Manage semiconductor assembly activities across prototype and production builds
• Work with OSAT and manufacturing partners on package assembly and process development
• Support new product introduction and manufacturing readiness activities
• Drive yield improvement and root-cause analysis for assembly-related issues
• Coordinate reliability testing, qualification, and failure analysis activities
• Collaborate with design, test, and product engineering teams to optimise manufacturability
• Create and maintain assembly documentation, process flows, and manufacturing specifications
• Identify continuous improvement opportunities across quality, cost, and production efficiency

Skills

Problem-solving

Analytical thinking

Communication

Teamwork

Attention to detail

Education

Electronic Engineering degree

Materials Science degree

Manufacturing Engineering degree

Tools

OSATs

Job description

About Us

Forefront RF is a fabless semiconductor company developing breakthrough RF technology that radically simplifies RF front-end architectures for mobile and connected devices. Our long-term vision is to empower anyone to treat global connectivity as a commodity, effortlessly adding it to any device. We lead through innovation, solving our customers' toughest challenges, enabling them to stay ahead by pushing the boundaries of RF design.

Location

Cambridge, UK

Team

New Product Introduction

Job Type

Full-Time, Permanent

About Us

Forefront RF is a fabless semiconductor company developing breakthrough RF technology that radically simplifies RF front-end architectures for mobile and connected devices. Our long-term vision is to empower anyone to treat global connectivity as a commodity, effortlessly adding it to any device. We lead through innovation, solving our customers' toughest challenges, enabling them to stay ahead by pushing the boundaries of RF design.

Our Values

Our values are the quiet nudge that help us to be our best in every interaction.

• One team: We listen, share, and build solutions together. Collaboration is at the heart of how we work. We support one another, embrace challenges and fun, and celebrate collective success.
• Innovation with intent: We operate at the forefront of technology, building innovative pathways to the future that meets real customer needs
• Solutions driven: We develop world leading manufacturable products that deliver effortless connectivity.
• Customer focused: We act with integrity, hold ourselves accountable, and are guided by a deep commitment to deliver customer focused solutions.
• Sustainable: We design for longevity and reuse - leveraging globally connected RF technology to extend product lifecycles and reduce waste

Role Overview

We're looking for an Assembly Engineer to help drive the assembly and packaging activities behind our RF semiconductor products as we continue to scale the business. This is a newly created role and an exciting opportunity to shape how we develop and transition products from prototype through to volume production.

You'll work closely with design, test, operations, suppliers, and manufacturing partners in a hands-on engineering environment, helping deliver robust, scalable, and high-quality packaging solutions for next-generation products.

Key Responsibilities

• Manage semiconductor assembly activities across prototype and production builds
• Work with OSAT and manufacturing partners on package assembly and process development
• Support new product introduction (NPI) and manufacturing readiness activities
• Drive yield improvement and root-cause analysis for assembly-related issues
• Coordinate reliability testing, qualification, and failure analysis activities
• Collaborate with design, test, and product engineering teams to optimise manufacturability
• Create and maintain assembly documentation, process flows, and manufacturing specifications
• Identify continuous improvement opportunities across quality, cost, and production efficiency

Requirements

About you

You're excited by the opportunity to work with breakthrough technologies.

You may thrive in this role if you have some or all the following:

Education & experience

• Degree in Electronic Engineering, Materials Science, Manufacturing Engineering, or similar
• Experience in semiconductor assembly, packaging, or manufacturing engineering
• Understanding of semiconductor packaging and assembly processes
• Familiarity with OSATs and outsourced semiconductor manufacturing
• Experience with yield improvement, failure analysis, and process optimisation

Desirable

• Experience with RF or mixed-signal semiconductor products
• Knowledge of reliability and qualification processes
• Familiarity with manufacturing data analysis and process control
• Understanding of advanced semiconductor packaging technologies
• Experience supporting consumer, IoT, or automotive semiconductor products

People Skills

• Proactive approach to problem-solving with a resilient attitude towards ambiguity.
• Excellent problem-solving and analytical skills
• Strong communication and collaboration abilities
• Ability to work independently and as part of a team
• Attention to detail and commitment to producing high-quality output

Benefits

• Competitive salary and pension contributions
• Company Share Option Scheme
• 25 days holiday + bank holidays
• Weekly company lunches
• Flexible work hours and remote work options
• Private medical insurance
• Life assurance x 4
• Income protection
• Healthshield Cash plan
• Heka flexible benefits platform

We believe in equal opportunities

We are an equal opportunity employer and value diversity at our company. We do not discriminate on the basis of race, religion, colour, sex, gender identity, sexual orientation, age, non-disqualifying physical or mental disability, national origin, veteran status, or any other basis covered by appropriate law. All employment is decided on the basis of qualifications, merit, and business need.