Quantum Packaging Technician: Flexible Work & Equity

Quantum Software; Greater London; Hybrid; GBP 42,000 - 60,000; Full time

Benefits offered by this job

Competitive salary

Share options

Pension scheme

Medical insurance

Laptop provided

Life Assurance

Cycle to work

Flexible working

Central London

Job summary

Quantum Motion in London is seeking a Packaging Technician to join the 3D Integration and Advanced Packaging team. Your role will be to assemble, package, and test quantum processors, and support novel R&D activities within the team.

Based at our Islington hub, you will assemble PCBs, test packaged devices at room and cryogenic temperatures, and take ownership of a section of the packaging line while collaborating with electronics, IC, and software engineers to push scalable quantum computing

Qualifications

• 3+ years of experience in electronics assembly, including PCB manufacturing, soldering, wire bonding to integrated circuits, and/or flip-chip assemblies.
• 3+ years of experience with bench-top electronic test equipment, such as SMUs, VNAs, and/or oscilloscopes.
• Ability to work in a team and collaborate with other stakeholders in the company.

Responsibilities

• Assemble PCBs and final packaging of quantum devices on said PCBs.
• Support the development of automated testing at room and cryo temperatures.
• Perform testing on packaged devices to verify processing, integration, and yield.
• Take ownership of a dedicated section of the packaging pipeline, maintaining a clear list of maintenance, support tasks, and assembly requirements.
• Support troubleshooting and debugging of quantum processors.

Skills

Electronics assembly

PCB manufacturing

Soldering

Wire bonding

Flip-chip

Tools

SMUs

VNAs

Oscilloscopes

Job description

Quantum Motion in London is seeking a Packaging Technician to join the 3D Integration and Advanced Packaging team. Your role will be to assemble, package, and test quantum processors, and support novel R&D activities within the team.

Based at our Islington hub, you will assemble PCBs, test packaged devices at room and cryogenic temperatures, and take ownership of a section of the packaging line while collaborating with electronics, IC, and software engineers to push scalable quantum computing