Process Integration Engineer (early career)

Lumentum; Towcester; On-site; GBP 40,000 - 70,000; Full time

Job summary

An established industry player is seeking a motivated Process Integration Engineer to join its Chip R&D team. This role involves developing and managing wafer fab processes for innovative semiconductor optical components. You will collaborate with diverse engineering teams to implement device designs into functional chips, enhancing existing processes for efficiency and yield. If you have a passion for semiconductor technology and enjoy working in a dynamic environment, this opportunity could be your next career move. Join a team where your contributions will have a real impact on cutting-edge technology!

Qualifications

• Degree in relevant field or equivalent experience in fab engineering.
• Practical knowledge of semiconductor wafer processing techniques.

Responsibilities

• Integrate processing steps for new InP based products.
• Monitor product development through wafer fab.
• Analyze processes using Six Sigma techniques.

Skills

Semiconductor wafer processing techniques

Epitaxy

Lithography

Dry and wet etching

Dielectric/metal deposition

Process integration

Statistical methods

Teamwork

Technical leadership

Communication skills

Education

Degree in physics

Degree in physical chemistry

Degree in materials science

Tools

JMP software

Job description

It's fun to work in a company where people truly BELIEVE in what they're doing!
We're committed to bringing passion and customer focus to the business.

If you like wild growth and working with happy, enthusiastic over-achievers, you'll enjoy your career with us!

Process Integration Engineer (Chip, R&D, NPI, Wafer Fab Semiconductor)

Lumentum have an opportunity for an early career Process Integration Engineer to join our Chip R&D team to develop and manage wafer fab processes for fabrication of indium phosphide based semiconductor optical components. This role is based at the Caswell, Northamptonshire, UK site. It is an on-site position, with limited opportunity for hybrid working.

JOB ROLE:

The Chip R&D department is responsible for development and introduction into production of new lasers, modulators, receivers, and photonic integrated circuits (PICs) for cloud and networking applications. As an integration engineer you will be responsible for the successful implementation of device designs into functional chips. This will require collaborative working with staff from a wide range of engineering teams with many different skills to solve challenging problems with real commercial impact.

KEY RESPONSIBILITIES:

• Integration of processing steps to realise new InP based products for both coherent and direct detection photonic semiconductor components, using existing and new wafer fab processes.
• Improvements of existing wafer fab processes for yield, cost and / or cycle time.
• Writing of process flows / procedures on the wafer fab MES system.
• Monitoring progress and performance of new products through the wafer fab during product development.
• Use of analysis tools, such as SEM, to understand processes.
• Development of new process modules required for realising novel chips, and ensuring these processes are manufacturable in volume.
• Transfer into manufacture these new process steps and new chips.
• Analysis / documentation of product / processes using Six Sigma techniques such as FMEA, capability analysis, design for manufacture/yield, etc
• Presentation of wafer process information with statistical evidence for manufacturability.
• To act as the interface between the design team and operations engineering and manufacturing teams.
• To be the process expert for the chips, even after transfer to production control.

SKILLS AND EXPERIENCE

Essential Experience and Skills:

• Degree in physics, physical chemistry, materials science, or similar. Relevant experience in a fab engineering role will be taken into consideration in lieu.
• Practical knowledge of a broad range of semiconductor wafer processing techniques, ideally in III-V materials. This should include several of the following areas: epitaxy, lithography, dry and wet etching, dielectric / metal deposition, implant, diffusion.
• Experience of developing process flows, process integration of existing and new wafer processes.
• Knowledge of direct bandgap semiconductor materials would be advantageous.
• Proven ability to manage and execute complex engineering activities.
• Previous industrial, production, wafer fab experience would be advantageous.

Skills/Competencies:

• Ability to use scientific and engineering reasoning in a wide range of situations.
• Familiarity with statistical methods, ideally experience using JMP software.
• Ability to work in a team, and with excellent organizational skills.
• Strong technical leadership skills.
• Able communicator, verbal and written.
• Willingness to travel worldwide to visit other Lumentum engineering teams.

We are an equal opportunity employer and value diversity at our company.

We do not discriminate on the basis of race, religion, color, national origin, sex, gender, gender expression, sexual orientation, age, marital status, veteran status, or disability status.

We will ensure that individuals with disabilities are provided reasonable accommodation to participate in the job application or interview process, to perform essential job functions, and to receive other benefits and privileges of employment.

Please contact us to request accommodation.