Principal Semiconductor Packaging Engineer

JR United Kingdom; Norwich; On-site; GBP 50,000 - 75,000; Full time

Job summary

A leading edge client based in Oxford seeks a Principal Packaging Engineer to manage the packaging roadmap and develop innovative methods for quantum processor devices. Candidates should possess strong expertise in semiconductor and photonics packaging, effective communication skills, and the ability to work with various suppliers.

Qualifications

• Experience in semiconductor/photonic packaging methods.
• Knowledge of die bonding methods for thermal performance.
• Experience with 3rd party suppliers.

Responsibilities

• Steer packaging roadmap and coordinate with internal/external providers.
• Develop and produce quantum processor devices.
• Design and supervise failure analysis experiments.

Skills

Semiconductor packaging methods

Photonics knowledge

Die bonding methods

3rd party supplier collaboration

Internal communication skills

External communication skills

Job description

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Job Views:

2

Posted:

04.06.2025

Expiry Date:

19.07.2025

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Job Description:

Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.

Required skills for the Principal Packaging Engineer will include:

• Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
• Knowledge of die bonding methods for good thermal and mechanical performance
• Experience working with 3rd party suppliers
• Strong internal and external communication skills

Please contact Rachel Anderson for further details.