Enable job alerts via email!
Boost your interview chances
Create a job specific, tailored resume for higher success rate.
An expanding company in the high-tech communications sector is seeking a Principal RF IC Design Engineer. This role offers the chance to work on cutting-edge technologies in antenna design for broadband mobility, satellite communications, and IoT. You will lead the design of advanced RF transmitters and receivers, ensuring high performance and timely delivery. The ideal candidate will have extensive experience in RF IC design, a strong educational background, and the ability to mentor and lead teams. Join a dynamic environment where your expertise will drive innovation in next-generation satellite communications.
Social network you want to login/join with:
col-narrow-left
ic resources
Cambridge, United Kingdom
-
Yes
col-narrow-right
581b192deb70
8
26.04.2025
10.06.2025
col-wide
This is an exciting opportunity for an experienced RF IC Design or MMIC Designer to join an expanding company working on high-tech communications and radar technologies.
In this role, you will have the opportunity to work on antenna technology serving markets including broadband mobility, satellite communications, and the Internet of Things (IoT).
As the Principal RF IC Design Engineer, you will lead the design of Ku/Ka band RF Transmitters & Receivers using deep sub-micron technologies for next-generation satellite communications. You will be responsible for ASIC specifications, architecture design, circuit design & verification, review, IC qualification, and production release.
You will develop new circuit architectures, design/verification methodologies to deliver ASICs meeting all performance requirements within timelines. You will own and lead chip-level development, collaborate with block-level design and layout engineers, and work closely with the test team for ASIC characterization.
You will lead and mentor RF IC Design engineers and coordinate with layout, test, systems, antenna, and hardware teams to ensure on-time delivery of ASICs. You will also assist in selecting fabrication processes & technology vendors, setting up process flows, and ensuring design governance.
The ideal candidate will have a degree in industry-related fields, with at least 10 years of experience in RF IC design in deep sub-micron technologies (preferably 15GHz or higher frequencies) and chip lead experience in 2 or more successful tape-outs.
Responsibilities include ASIC specifications, architecture design, top-level and block-level design & verification, RF block design, and collaboration across teams to ensure quality and delivery.
Experience in 22nm FDSOI or other sub-45nm CMOS process nodes for RF/High-speed ICs, mmW/RF IC design, LNA design, and RF PAs is desirable.
Excellent communication skills and the ability to manage complex designs within deadlines are required, along with the ability to interact across multiple engineering disciplines.
Contact Leon to apply and find out more.