Photonics Packaging Scientist - 241

Quantinuum; London; On-site; USD 123,000 - 153,000; Full time

Job summary

Join Quantinuum as a Photonics Packaging Scientist, where you'll lead innovations in photonic integrated circuit packaging for quantum computing applications. This role requires extensive experience in advanced packaging technologies to contribute to cutting-edge projects alongside a world-class team. Ideal candidates have a solid background in engineering, a track record of innovation, and a passion for pioneering technologies in a dynamic work environment.

Benefits

Flexible work schedule

Employer subsidized health, dental, and vision insurance

401(k) match for student loan repayment benefit

Paid parental leave

Employee discounts

Generous vacation and sick time

Equity and retirement savings plan

12 paid holidays

Qualifications

• 3 years’ experience in advanced PIC packaging development.
• Experience with large area chips, multi-chip packaging, and heterogeneous integration.
• Experience in a cross-functional team environment.

Responsibilities

• Develop and implement advanced packaging concepts for optical interfaces.
• Support all stages of ion trap development for packaging compatibility.
• Engage with vendors for packaging process validation.

Skills

Advanced PIC packaging development

High-density photonic I/O technologies

Innovation and IP development

Education

Bachelor’s degree minimum

PhD in Physics or Engineering

Job description

Science Led, Enterprise Driven – Accelerating Quantum Computing

Quantinuum is the world’s largest integrated quantum company, pioneering powerful quantum computers and advanced software solutions. Quantinuum’s technology drives breakthroughs in materials discovery, cybersecurity, and next-gen quantum AI. With approximately 500 employees, including 370+ scientists and engineers, Quantinuum leads the quantum computing revolution across continents.

We unite best-in-class software with high-fidelity hardware to accelerate quantum computing. With integrated full-stack technology, our world-class team is rapidly scaling quantum computing.

Quantinuum recently secured $300M in funding, visit our news pages to learn more about this and other Quantinuum scientific breakthroughs and achievements: https://www.quantinuum.com/news

We are seeking a Photonics Packaging Scientist in our New Mexico Location. We are looking for an engineer with broad experience in packaging of photonic integrated circuits (PICs) to develop innovative and reliable packaging schemes for the highly scaled ion traps in our quantum computers.

All applicants for placement in safety-sensitive positions will be required to submit to a pre-employment drug test.

Key Responsibilities:

• Develop and implement advanced packaging concepts for optical and detection interfaces to next-generation ion traps
• Develop packaging strategies and processes for large-format ion trap chips with high I/O signal count and density
• Work with vendors to implement and validate packaging processes
• Support all stages of ion trap development to ensure compatibility with packaging
• Interface with broader Quantinuum team to ensure ion trap packaging meets system requirements
• Engage with 3rd parties to cultivate possible key partnerships, supplier relationships, and co-development opportunities

YOU MUST HAVE:

• Bachelor’s degree minimum
• Minimum 3 years’ experience in advanced PIC packaging development
• Due to Contractual requirements, must be a U.S. Person. defined as, U.S. citizen permanent resident or green card holder, workers granted asylum or refugee status
• Due to national security requirements imposed by the U.S. Government, candidates for this position must not be a People's Republic of China national or Russian national unless the candidate is also a U.S. citizen.

WE VALUE:

• PhD in Physics or Engineering
• 7 years’ experience with advanced PIC packaging technologies and fiber-to-chip coupling
• 5 years’ experience with high-density photonic I/O technologies
• 5 years’ experience with visible-wavelength PIC packaging
• 3 years’ experience with large area chips, multi-chip packaging, bump bonding, heterogeneous integration and 2.5-3D packaging techniques
• A proven track record of innovation and IP development
• Experience working with Outsourced Semiconductor Assembly and Test (OSAT) vendors
• Experience setting up a packaging lab, with knowledge of the equipment and vendors
• Experience working within a cross-functional team environment

$123,000 - $153,000 a year

Compensation & Benefits:

Non-Incentive Eligible

Estimated Salary Wage: $123,000 - $153,000 Annually

What is in it for you?

-A competitive salary and innovative, game-changing work

-Flexible work schedule

-Employer subsidized health, dental, and vision insurance

-401(k) match for student loan repayment benefit

-Equity, 401k retirement savings plan + 12 Paid holidays and generous vacation + sick time

-Paid parental leave

-Employee discounts

Quantinuum is an equal opportunity employer. You will be considered without regard to age, race, creed, color, national origin, ancestry, marital status, affectional or sexual orientation, gender identity or expression, disability, nationality, sex, or veteran status.