PCB Designer

Morson Talent; Portsmouth; Remote; GBP 80,000 - 100,000; Full time

Job summary

A recruitment agency is seeking a PCB Designer to join a team focused on high-quality PCB designs. The role involves generating designs from initial concepts through to manufacturing data packs. Successful candidates will have a strong background in PCB design, particularly with Cadence Allegro, and experience with complex, multi-layer designs. This position allows for remote work, with onsite attendance required initially to collect IT equipment.

Qualifications

• Proven experience in PCB design and layout.
• Detailed knowledge of PCB design tools and techniques.
• Capability to read and interpret technical drawings.

Responsibilities

• Work with a team generating PCB designs.
• Undertake design activities from concept to manufacturing.
• Maintain toolsets and supporting libraries/databases.

Skills

Proven ability of Cadence Allegro toolset

PCB design techniques for large, complex, multi-layer, multi-substrate, PCBs

Designing for controlled impedance, high speed digital, RF

Knowledge of blind, buried, and filled via techniques

Proven ability of flexible PCB and interconnecting assemblies

Ability to work to ISO9001 and IPC-610 standards

Job description

PCB Designer

Location: Broad Oak, remote working, onsite day 1 to collect IT

Duration: 6 Months

Rate: £51.60 ph PAYE (£59.10 ph Inclusive of holiday pay) or £69.65 ph Umbrella

The Printed Circuit Board Designer will:

• Be part of a small team generating approximately 30 PCB designs per year.
• Have detailed knowledge and experience of tools and techniques required to generate large, complex, multi-substrate PCB designs.
• Undertake PCB design activities from initial concepts through to generation of manufacturing data packs.
• Help maintain toolsets and supporting libraries/databases.

Key Skillset

• Proven ability of Cadence Allegro toolset
• PCB design techniques for large, complex, multi-layer, multi-substrate, PCBs.
• Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies.
• Knowledge of blind, buried, and filled via techniques.
• Proven ability of flexible PCB and interconnecting assemblies.
• Ability to work with complex mechanical profiles to accommodate enclosure, structural, thermal, and screening requirements.
• Ability to work to ISO9001 and IPC-610 standards.
• Must understand detailed technical instructions and be able to communicate complex technical information to others