Microelectronic Interconnect Operations Manager

Particle Physics Oxford; Oxford; On-site; GBP 48,000 - 58,000; Full time

Job summary

A leading research institution in Oxford is looking for a Microelectronic Interconnect Operations Manager to supervise interconnect and wire-bonding activities in a cleanroom facility. The ideal candidate will bring significant experience in managing concurrent projects and leading a team, ensuring high-quality work in a timely manner. The position offers competitive pay and excellent benefits including generous annual leave and a supportive work environment.

Benefits

38 days annual leave

Discounted travel

Contributory pension scheme

Student discounts

Qualifications

• Significant experience with interconnect systems.
• Experience with large detector/imaging sensors.
• Comfortable in a research-based environment.

Responsibilities

• Manage interconnect and wire-bonding activities.
• Supervise and train a team of junior operatives.
• Ensure deadlines are met for multiple concurrent projects.

Skills

Management

Problem-solving

Organisational Skills

Tools

Wire-bonding systems

Job description

Microelectronic Interconnect Operations Manager

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Microelectronic Interconnect Operations Manager

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Microelectronic Interconnect Operations Manager Particle Physics, Department of Physics, Denys Wilkinson Building, Keble Road, Oxford, OX1 3RH

About The Role

We have an exciting opportunity in the Particle Physics Sub-Department at the University of Oxford for an experienced Microelectronic Interconnect Operations Manager.

We are looking for an organised and independent expert to take a leading role in all aspects of our interconnect and wire-bonding activities in the Oxford Physics Microstructure Detector (OPMD) laboratory. OPMD is a cleanroom silicon facility in central Oxford, working on radiation imaging silicon detectors, primarily for Particle Physics, such as the ATLAS experiment at CERN. This will involve managing the interconnect work for long-term production projects including large arrays of full-recticle and wafer-size semiconductor sensors, as well as one-off R&D pieces and small commercial activities requiring a rapid turnaround.

This post is full time and permanent. We will also consider this post as an underfill if you are unable to meet all of the selection criteria at grade 7 with an appropriate adjustment in duties, focusing more on being an interconnect specialist rather than managing systems.

You will be responsible for the operation and maintenance of a suite of semi-automatic ultrasonic wire-bonding systems, as well as part preparation and quality control systems including: plasma-cleaning, pull-testing, QC inspection, glue deposition, and die attach. You should have the experience to be able to suggest changes to prototype PCB or ASIC designs to improve the reliability and performance of interconnects for in-house and external projects. You will additionally be responsible for the training and supervision of an apprentice interconnects technician.

You will manage a small team of junior interconnect operatives to assist them with their learning and development and manage their workflows.

About You

We need an expert operator who can take responsibility for managing multiple concurrent projects of different scales and levels of importance. You will need to be comfortable working in a research-based environment, but also be expected to bring a more production-based mindset to ensure deadlines are met. In addition to significant experience working with interconnect systems, experience with large detector/imaging sensors, and working in academic collaborations would be extremely valuable, as would experience working in a cleanroom and managing a laboratory.

What We Offer

We will provide you with a welcoming and inclusive workplace, offering support and development opportunities that will enable you to progress and do your best work. We recognise diversity as our strength, vital for innovation and creativity, and we aspire to build a truly diverse community, which values and respects every individual’s unique contribution.

You will receive 38 days’ annual leave inclusive of Bank Holiday and fixed closure dates, discounted travel, an excellent contributory pension scheme, and student discount. You will also be part of the University’s annual apprenticeship awards.

Contact us

If you would like further information or support in your application please contact:

• Richard Plackett – Recruiting Manager - [e-mail]
  
  

The closing date for applications is 12:00 noon on 8 July 2025 only applications received before [closing date and time] can be considered.

Contact Person : HR Team Vacancy ID : 179997 Contact Phone : Closing Date & Time : 08-Jul-2025 12:00 Pay Scale : RESEARCH GRADE 8 Contact Email : [e-mail] Salary (£) : £48,235 - £57,255 p.a. Click on the link(s) below to view documents Filesize 179997 Inteconnect JD in template 2025 jd-and-person-spec-physics-may-19-46412.pdf 342.4 Return to Search Results Apply Now

Seniority level

• Seniority level

  Mid-Senior level

Employment type

• Employment type

  Full-time

Job function

• Job function

  Management and Manufacturing

• Industries

  Research Services

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