Lead RF IC Design Engineer

ic resources; Cambridge; On-site; GBP 70,000 - 100,000; Full time

Job summary

A leading company in high-tech communications is looking for a Lead RF IC Design Engineer to join their team. The role involves designing Ku/Ka band RF Transmitters & Receivers and leading a team in developing innovative solutions for satellite communications. Candidates should possess extensive experience in RF IC design with proven track records in successful projects.

Benefits

Visa sponsorship available

Qualifications

• Minimum 10 years of RF IC design experience in deep sub-micron technologies.
• At least 2 successful tape-outs with chip lead experience.

Responsibilities

• Responsible for ASIC specifications, architecture design, and verification.
• Design transmitter & receiver blocks in Ku/Ka band.
• Lead and mentor a team of RF IC Design engineers.

Skills

RF IC design

Communication skills

Leadership

Collaboration

Education

Industry degree

Job description

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Opportunity for Lead RF IC Design or MMIC Designer

This is an opportunity for a Lead RF IC Design or MMIC Designer to join an expanding company working on high-tech communications and radar technologies.

In this role, you will have the opportunity to work on antenna technology serving markets including broadband mobility, satellite communications, and Internet of Things (IoT).

As the Lead RF IC Design Engineer, you will take a leadership role responsible for designing Ku/Ka band RF Transmitters & Receivers using deep sub-micron technologies for next-generation satellite communications. You will be responsible for ASIC specifications, architecture design, circuit design & verification, review, IC qualification, and production release.

You will lead and mentor a team of RF IC Design engineers and collaborate across departments, including layout, test, systems, antenna, and hardware teams, to ensure on-time delivery of ASICs. You will also assist in selecting fabrication process & technology vendors, setting up process flows, ensuring design governance, creating product development plans, and technology roadmaps.

Industry degree qualified candidates with a minimum of 10 years of experience in RF IC design in deep sub-micron technologies (preferably 15GHz or higher) with chip lead experience in at least 2 successful tape-outs are encouraged to apply.

Responsibilities Include:

1. ASIC specifications, architecture design, top-level design & verification, block-level designs, and on-time tape-out of ASICs.
2. Design of transmitter & receiver blocks in Ku/Ka band in deep sub-micron CMOS technologies.
3. Hands-on block-level design of RF blocks such as PA, LNA, VGA, phase shifters, power splitters/combiners.
4. Delivering high-quality RF/Analog blocks with leading-edge performance using innovative architectures and circuit implementations.
5. Coordinate and manage design activities with colleagues.
6. Collaborate with CAD, process technology, package design, antenna, and hardware teams.
7. Document work and lead design reviews.
8. Experience in 22nm FDSOI or other sub-45nm CMOS process nodes for RF/high-speed ICs, and/or experience in mmW/RF IC design, LNA design, and RF PAs is desired.

Excellent communication skills are required, along with the ability to handle complex circuit and system designs within deadlines. You should be able to interact with multidisciplinary engineering teams during ASIC project development.

Visa sponsorship is available for the successful applicant.

Contact Leon to apply and find out more.