Lead Engineer - Body Electronics

Tata Technologies Ltd.; Woking; On-site; GBP 70,000 - 120,000; Full time

Job summary

Tata Technologies Ltd. in the United Kingdom is seeking a Body Electronics Lead Engineer to drive the technology roadmap for future automotive embedded systems.

You will lead a core design and development team, shaping specifications for production-ready electronics. You will operate within ASPICE-aligned processes spanning systems engineering, software, and validation, coordinating DFMEA, HW/SW integration and supplier interfaces to meet high-quality, reliable targets.

Qualifications

• ASPICE process alignment
• Embedded systems knowledge
• System/Software integration planning
• DFMEA awareness
• Quality and reliability mindset

Responsibilities

• System and components specifications
• DFMEA
• BoM management and Engineering release (SAP Structuring & Releases)
• Validation planning (DVP)
• Test specifications
• Timing plan and project management
• Interface on CAN/LIN or Ethernet
• Root Cause analysis (SW and HW) and Systems sign-off
• Attributes delivery
• Component functional testing & calibration
• Supplier Management, Component suppliers
• Define Scope of change, Software requirements and ARXML changes
• SW Validation
• Definition of ECU Pin-outs, Connector & Harness Definition
• Manage localization plan for new regions
• Update and maintain test tool and test scripts
• Costing & Budget planning - HW
• Define and maintain component time plan (HW & SW)
• Define EOL Configuration
• Technology Road map for next Gen HW
• HW samples for build readiness (Manage/Order and update HW Units)
• Package Clearance and Serviceability, Assembly Sequence (Vehicle Assembly)
• Brackets Management
• Cost / weight reduction ideas
• PPAP
• Certification
• Plant Issue Investigation
• Warranty Claim Investigation

Job description

Body Electronics Lead Engineer

Our Embedded Systems Solutions department (ESS) encompasses all activities outlined under the Automotive SPICE (ASPICE) process framework, including systems engineering, software engineering, coding, and all levels of functional testing. Beyond core development, ESS also integrates critical supporting processes such as project management, risk assessment, functional safety, and cybersecurity, ensuring compliance with ASPICE standards and delivering reliable, secure, and high-quality embedded systems & solutions.

The Role:

As a member of the Body Electronics team, you will be part of a core systems design & development team focused on systems for future McLaren sports cars. You will be responsible for identifying future technology, defining a technology roadmap and following that roadmap, developing technology through the engineering lifecycle, into production.
The position requires a highly motivated and hands‑on team player with exceptional attention to detail, diligence, and a positive attitude. The fast‑paced development and bespoke target platform provides a challenging environment suited to an engineer who can quickly develop skills in new areas and liaise with other engineering teams within a multidisciplinary environment. Our customers expect high standards, and we require team capable of meeting such demands.

Area of Responsibility

• System and components specifications


• DFMEA


• BoM management and Engineering release (SAP Structuring & Releases)


• Validation planning (DVP)


• Test specifications.


• Timing plan and project management


• Interface on CAN/LIN or Ethernet


• Root Cause analysis (SW and HW) and Systems sign-off


• Attributes delivery


• Component functional testing & calibration.


• Supplier Management, Component suppliers


• Define Scope of change, Software requirements and ARXML changes


• SW Validation


• Definition of ECU Pin-outs, Connector & Harness Definition


• Manage localization plan for new regions


• Update and maintain test tool and test scripts


• Costing & Budget planning - HW


• Define and maintain component time plan (HW & SW)


• Define EOL Configuration


• Technology Road map for next Gen HW


• HW samples for build readiness (Manage/Order and update HW Units)


• Package Clearance and Serviceability, Assembly Sequence (Vehicle Assembly)


• Brackets Management


• Cost / weight reduction ideas


• PPAP


• Certification


• Plant Issue Investigation


• Warranty Claim Investigation