Industry 4.0 Lead: Smart Manufacturing & Data Pipelines

TT Electronics plc; Newcastle upon Tyne; On-site; GBP 90,000 - 120,000; Full time

Benefits offered by this job

Enhanced pension

Employee assistance

Site incentive

Shopping discounts

Cycle to work

RAC membership discount

Gym membership

5 weeks holidays

Wellbeing environment

Job summary

TT Electronics Bedlington is seeking a Lead Digitisation Engineer to drive the strategy, architecture and implementation of automated data pipelines, IoT integration and smart manufacturing systems.

You will lead projects bridging traditional semiconductor and packaging processes with cutting-edge digital infrastructure, enabling predictive maintenance, yield optimisation and lights-out automation across cleanroom and assembly lines.

Qualifications

• Experience leading Industry 4.0 or smart manufacturing initiatives.
• Track record delivering digital transformation from concept to deployment.
• Familiar with microelectronics equipment and factory automation protocols.
• Proficient in data analysis languages and visualization tools.
• Strong communication of complex technical concepts to stakeholders.

Responsibilities

• Designing and owning the Industry 4.0 Strategy & Roadmap.
• Driving the integration of legacy and modern microelectronics equipment.
• Architecting robust data pipelines to collect, store, and analyse process data.
• Collaborating with process engineers to implement APC, SPC, and ML models.
• Leading multidisciplinary projects with cross functional collaboration.
• Evaluating, selecting, and managing external vendors and system integrators.

Skills

Industry 4.0

Data pipelines

Time-series data

Cloud/edge computing

Programming for data analysis

Data visualization tools

Project management

Stakeholder communication

Tools

SCADA

Job description

TT Electronics Bedlington is seeking a Lead Digitisation Engineer to drive the strategy, architecture and implementation of automated data pipelines, IoT integration and smart manufacturing systems.

You will lead projects bridging traditional semiconductor and packaging processes with cutting-edge digital infrastructure, enabling predictive maintenance, yield optimisation and lights-out automation across cleanroom and assembly lines.