Graduate MEMS Packaging Engineer

JR United Kingdom; Broughton; On-site; GBP 28,000 - 35,000; Full time

Job summary

Une start-up technologique dynamique propose un poste d'Ingénieur en Emballage MEMS destiné aux récents diplômés. Ce rôle offre une expérience pratique en soutenant le développement et les tests des processus d'emballage MEMS. Les candidats doivent avoir des compétences en résolution de problèmes et un diplôme en ingénierie.

Qualifications

• Récemment diplômé avec un diplôme en ingénierie électronique, mécanique ou discipline connexe.
• Expérience en emballage de semi-conducteurs, MEMS ou technologies RF est bénéfique.

Responsibilities

• Soutenir le développement des processus et matériaux d'emballage MEMS et d'antennes.
• Effectuer des tests en laboratoire et participer à la conception de tests de fiabilité.

Skills

Problem solving

Fundamental engineering principles

Basic statistics

Semiconductor packaging

MEMS technologies

RF technologies

Education

Bachelor’s degree in Electronics Engineering

Bachelor’s degree in Mechanical Engineering

Bachelor’s degree in Materials Science

Job description

Social network you want to login/join with:

Graduate MEMS Packaging Engineer, broughton

col-narrow-left

Client:

IC Resources

Location:

broughton, United Kingdom

Job Category:

Other

-

EU work permit required:

Yes

col-narrow-right

Job Views:

4

Posted:

10.06.2025

Expiry Date:

25.07.2025

col-wide

Job Description:

Our Edinburgh based client is currently searching for a Graduate MEMS Packaging Engineer to join the Operations team. This is an excellent opportunity for a recent graduate with a degree in Electronics, Mechanical Engineering, or a related field to gain hands-on experience in a fast-paced, high-impact technology startup. The role will involve supporting the development of MEMS and antenna subassembly packaging processes and materials. Conducting lab based tests and participating in the design and execution of reliability tests will be an important part of the role.

Required skills for the Graduate MEMS Packaging Engineer will include:

• Strong grasp of fundamental engineering principals (DOE, basic statistics)
• Problem solving mind-set
• Exposure to semiconductor packaging, MEMS, or RF technologies beneficial
• Bachelor’s degree in Electronics Engineering, Mechanical Engineering, Materials Science, or a related discipline.

Please contact Rachel Anderson for further details.