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Graduate MEMS Engineer

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City of Edinburgh

On-site

GBP 28,000 - 35,000

Full time

16 days ago

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Job summary

A leading tech company seeks a MEMS Engineer based in Edinburgh to support the development of MEMS and Antenna packaging processes. This opportunity is ideal for recent graduates or early-career professionals eager to gain hands-on experience in a dynamic R&D environment.

Qualifications

  • Understanding of MEMS technology and packaging processes.
  • Keen to learn and grow in a collaborative environment.

Responsibilities

  • Support packaging development and manufacturing activities.
  • Run lab tests, analyze data, and troubleshoot technical issues.
  • Contribute to design and conduct reliability testing.

Skills

Clear communication
Proactive mindset
Hands-on learning

Tools

CAD tools (e.g., SolidWorks)

Job description

Job Description

MEMS Engineer – Edinburgh - Satellite Communications

Are you a recent graduate ready to kick-start your engineering career in a fast-growing tech company, or have industry experience and are seeking a new opportunity? We're looking for a MEMS Packaging Engineer to join a key client in Edinburgh.

You’ll play a key role in the development of cutting-edge MEMS and Antenna packaging processes for advanced communication systems. This is an ideal role for someone early in their career or a recent graduate keen to gain further hands-on experience in a dynamic R&D environment.

What you’ll do:

  • Support packaging development and manufacturing activities
  • Run lab tests, analyse data, and troubleshoot technical issues
  • Contribute to the design of and conduct reliability testing
  • Collaborate with cross-functional engineering teams
  • Maintain accurate documentation and improve processes

What we’re looking for:

  • An understanding of MEMS technology
  • An understanding of Packaging processes
  • Clear communication and a proactive, hands-on mindset
  • Keen to learn and grow in a collaborative, high-tech environment

Bonus if you have:

  • Placement or internship experience in an engineering role
  • Exposure to MEMS, RF, or semiconductor packaging
  • Familiarity with CAD tools (e.g., SolidWorks) or lab equipment

If you would like further information about this opportunity or are interested in making an application, please contact Luke Ord.

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