Electronics and Hardware Engineer for National Security

Leidos; Leominster; Hybrid; GBP 48,000 - 61,000; Full time

Benefits offered by this job

Contributory Pension Scheme

Private Medical Insurance

33 days Annual Leave

Flexible benefits

Flexi Time Working

Job summary

Leidos UK is seeking an Electronics and Hardware Engineer to design, prototype and deliver custom electronic devices for national security applications. The role is primarily on-site in Hereford with four days per week on customer sites, collaborating with embedded software teams to turn ideas into working hardware.

You will create circuits, lay out PCBs, integrate RF/GPS/GSM/Bluetooth, and produce robust enclosures using 3D printing.

Qualifications

• Degree or HND in Electronics, Electrical Engineering, Mechatronics, or similar
• Hands‑on project experience valued — including personal/hobby projects

Responsibilities

• Design and build custom electronic circuits using COTS modules and discrete components
• Lay out PCBs (Altium or EasyEDA)
• Integrate wireless technologies: RF, GPS, GSM, Bluetooth
• Design and 3D print enclosures for devices
• Assemble prototypes: soldering, testing, debugging
• Support embedded software engineers with working hardware
• Capture and maintain documentation for builds and iterations
• Participate in on‑site integration, testing, and refinement with users

Skills

Electronics design

PCB layout

Wireless integration

Embedded MCUs

Soldering & prototyping

3D printing

Mechanical enclosure design

Testing & debugging

Documentation

Education

Degree in Electronics / Electrical / Mechatronics

Tools

Altium

EasyEDA

Job description

Leidos UK is seeking an Electronics and Hardware Engineer to design, prototype and deliver custom electronic devices for national security applications. The role is primarily on-site in Hereford with four days per week on customer sites, collaborating with embedded software teams to turn ideas into working hardware.

You will create circuits, lay out PCBs, integrate RF/GPS/GSM/Bluetooth, and produce robust enclosures using 3D printing.