Director of Field Applications Engineering- Europe and APAC

Baya Systems; Cambridge; Hybrid; GBP 150,000 - 210,000; Full time

Benefits offered by this job

Equity

Performance incentives

Job summary

Baya Systems in Cambridge, UK, is seeking a Director of Field Applications Engineering to lead a world‑class FAE team across Europe and APAC. You will drive the technical adoption, integration, and design‑win pipeline for our fabric interconnect IP, and provide pre and post‑sales support.

The role requires 10+ years in semiconductors and 5+ years in management, with deep NoC/PCIe/CXL knowledge, and excellent English. Remote‑Europe work with travel up to 30–40% is expected and equity is included.

Qualifications

• Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related STEM field.
• 5+ years of experience managing customer-facing engineering teams (FAE or Technical Support).
• 10+ years in the semiconductor, silicon IP, or high-performance networking sectors.

Responsibilities

• Lead a distributed team of FAEs across EU and APAC.
• Recruit and onboard top engineering talent in key regional hubs.
• Provide continuous technical mentorship and professional development.
• Set regional goals aligned with corporate objectives.
• Drive strategy to secure high-value design wins and oversee customer evaluations.

Skills

NoC architectures

PCIe/CXL fabrics

Team leadership

Customer engagement

European/APAC market knowledge

Education

Bachelor’s degree in Electrical/Computer Engineering

Tools

EDA tools (Synopsys Cadence Siemens)

Job description

Director of Field Applications Engineering- Europe and APAC

Cambridge, England, United Kingdom; Remote - Europe

Baya Systems is inspired by thebaya bird , also known as theweaver . Baya birds weave very unique and intricate hanging nests from different materials. The nests are robust and safe while being extremely lightweight and efficient.

Baya is a fast-moving Series B startup built by serial entrepreneurs with a vision to accelerate intelligent computing in the emerging chiplet era. We focus on software‑driven, unified fabric solutions for single‑die and multi‑die systems. We design and license disruptive intellectual property for use in semiconductor chips, with software development platforms to simplify the design process and reduce the time to market for complex System‑on‑Chip (SoC) and multi‑chiplet systems. This enables our partners to innovate and deliver compelling solutions for data center, infrastructure, AI, Automotive, and Edge IoT markets. We are looking for energetic and dedicated individuals who share our passion for enabling innovation and excellence in the semiconductor industry that empowers game‑changing products and services!

Role Overview

Lead and grow a world‑class Field Applications Engineering (FAE) team across Europe and the Asia‑Pacific region. You will drive the technical adoption, integration, and design‑win pipeline for our next‑generation fabric interconnect silicon IP. You will be responsible for both Pre and Post sales support.

• Position: Director, Field Applications Engineering
• Location: Remote (Based in the EU or the UK)
• Region Coverage: Europe (EU) and Asia‑Pacific (APAC)
• Travel: Up to 30‑40% international travel required

Key Responsibilities

• Manage: Lead a distributed team of senior FAEs across EU and APAC.
• Hire: Recruit and onboard top‑tier engineering talent in key regional hubs.
• Coach: Provide continuous technical mentorship and professional development.

Align: Set clear regional goals aligned with corporate business objectives.

Grow collaterals, to enable improved efficiency / ease of adoption by the customer.

Technical Account Management & Sales Support

• Drive Strategy: Partner with regional sales directors to secure high‑value design wins.
• Own Delivery: Act as the escalation point for critical customer technical issues.
• Guide Evaluation: Oversee customer proof‑of‑conceptions, evaluations, and architectural reviews.
• Present: Deliver technical keynotes, deep‑dives, and product demonstrations to C‑level executives.
• Feedback Loop: Funnel regional customer requirements directly to internal R&D and Product Management.
• Influence Roadmap: Use market insights to shape the future fabric interconnect IP roadmap.
• Enablement: Create application notes, whitepapers, and training collateral for regional ecosystems.

Required Qualifications

Experience & Education

• Education: Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related STEM field.
• Management: 5+ years of experience managing customer‑facing engineering teams (FAE or Technical Support).
• Industry: 10+ years in the semiconductor, silicon IP, or high‑performance networking sectors.

Technical Expertise

• IP Knowledge: Deep understanding of Network‑on‑Chip (NoC), AMBA protocols (CHI, AXI, ACE), or PCIe/CXL fabrics.
• Design Flow: Familiarity with front‑end ASIC design, SoC architecture, RTL verification, and EDA tools (Synopsys, Cadence, Siemens).
• Systems: Insight into AI/ML accelerators, data center architectures, and automotive SoC requirements.

Soft Skills & Logistics

• Communication: Exceptional English verbal and written communication skills.
• Cross‑Cultural: Proven experience managing teams and clients across diverse cultures in Europe and Asia.
• Autonomy: Self‑motivated style suited for a fast‑paced, early‑stage startup environment.

Preferred Qualifications

• Master’s degree or PhD in Electrical or Computer Engineering.
• Prior experience working in a fast‑growing, venture‑backed silicon IP startup.
• Existing technical relationships with major Tier‑1 semiconductor and system companies in the EU and APAC.
• Additional language skills relevant to the covered regions (e.g., Mandarin, Japanese, Korean, German).

Compensation

Salary commensurate with experience
Performance incentives
Equity