Assembly Process Engineer

Our Sedgefield-based client is currently seeking an Assembly Process Engineer to oversee all aspects of product assembly, with a focus on high-volume automated die attach and wire bonding equipment. The role involves developing and maintaining manufacturing equipment and processes, providing technical support for yield improvement, and liaising with equipment suppliers.

Key responsibilities include:

1. Managing semiconductor assembly manufacturing processes and equipment
2. Ensuring expertise in die attach and wire bonding processes
3. Driving process improvements
4. Communicating effectively with team members and suppliers

Requirements:

• Experience with semiconductor assembly manufacturing processes and equipment
• Detailed knowledge of die attach and wire bonding
• Process improvement skills
• Strong communication skills
• Relevant Engineering Degree or equivalent

Please contact Rachel Anderson for further details.