Embedded Electrical Engineer

Harmattan AI

Paris

Hybride

EUR 70 000 - 110 000

Plein temps

14 jours+
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Résumé du poste

Harmattan AI is seeking an Embedded Electrical Engineer to join the R&D team and own compute modules from architecture to production. You will design SoMs, baseboards, and test boards, addressing PCIe, 10 Gb Ethernet, USB 3.x, and MIPI with rigorous signal integrity and power design.

You will lead design reviews and collaborate with software, mechanical, and flight-qualification teams. You should have 5+ years in embedded hardware, MSc/Degree in a related field (PhD a plus), and hands-on

Qualifications

  • MSc in electrical, computer, or a related engineering field; PhD is a plus.
  • 5+ years in embedded hardware design with bring-up and production.
  • Proficiency in high-speed design, signal integrity, and validation.
  • Experience with boards using DDR/Flash memories and external memory layouts.
  • Power design experience with conversion topologies and power-up/down verification.
  • Deep knowledge of electronic CAD tools (e.g., Altium).
  • Experience planning thermal, vibration, EMC, and ESD qualification.
  • Fabrication/assembly collaboration on stack-up, vias, and cost trade-offs.
  • Strong problem-solving, autonomy, and clear communication with stakeholders.
  • Nice-to-have: FPGA/MPSoC, embedded AI inference, UAS/drone/defense hardware.

Responsabilités

  • Board Design: design SoMs, baseboards, and test boards for compute platforms.
  • High-Speed Digital Design: work around PCIe, 10 Gb Ethernet, USB 3.x, MIPI with SI in mind.
  • Power Design: craft power trees and verify power-up/down behaviour.
  • Design Reviews: lead milestones from block diagrams to fabrication release.
  • Manufacture: coordinate with PCB/EMS partners on stack-up and layout guidance.
  • Bring Up and Qualification: define tests, troubleshoot boards, and run thermal/vibration/EMC/ESD tests.
  • Cross-Functional Collaboration: coordinate with software, mechanical, and flight-validation teams.

Connaissances

High-speed design
Signal integrity
Autonomous hardware
Autonomy / self-motivation
Communication

Formation

MSc in Electrical/Computer Engineering
PhD (advantage)

Outils

Altium

Description du poste

About Us

Harmattan AI is a next-generation defense prime building autonomous and scalable defense systems. Following the close of a $200M Series B, valuing the company at $1.4 billion, we are expanding our teams and capabilities to deliver mission-critical systems to allied forces.

Our work is guided by clear values: building technologies with real-world impact, pursuing excellence in everything we do, setting ambitious goals, and taking on the hardest technical challenges. We operate in a demanding environment where rigor, ownership, and execution are expected.

About the role

As an Embedded Electrical Engineer at Harmattan AI, you will join the R&D team to design the compute modules and associated boards used across our platforms. You will own these designs end-to-end, from system architecture and schematic through layout guidance, fabrication, bring-up, and qualification. This is a high-impact role that combines demanding high-speed design work with hands-on bench work, taking hardware from a first prototype through to boards that fly.

Responsibilities

  • Board Design: Design SoMs, baseboards, and test boards for our compute platforms.

  • High-Speed Digital Design: Design around high-end application processors, covering PCIe, 10 Gb Ethernet, USB 3.x, and MIPI, managing layout constraints and signal integrity.

  • Power Design: Design power trees, sequencing, and conversion topologies, and verify power-up and power-down behaviour.

  • Design Reviews: Prepare and lead design reviews at each milestone, from block diagram to release for fabrication.

  • Manufacture: Work with PCB and EMS partners on stack-up, via technology, layout guidance, and cost trade-offs.

  • Bring Up and Qualification: Define verification test plans, troubleshoot and characterise boards, and run thermal, vibration, EMC, and ESD qualification.

  • Cross-Functional Collaboration: Work with the embedded software team through board bring-up, the mechanical team on form factor and thermal constraints, and validation for flight qualification.

Candidate requirements

  • Educational Background: MSc in electrical, computer, or a related engineering field. A PhD is a plus. A hands-on design and bring-up record matters more than the specific degree.

  • Experience: 5 years minimum in embedded hardware design, with boards taken from specification through bring-up and qualification into production.

  • Technical Expertise: High-speed design including layout constraints, signal integrity, and validation. Systems built around a processor with external memory (DDR, Flash) are carried through to a committed layout. Power trees with deliberate conversion topologies and verified power-up and power-down behaviour.

  • Tools: In-depth knowledge of electronic CAD tools (e.g., Altium).

  • Testing Proficiency: Proficiency with electronic test equipment and experience planning thermal, vibration, EMC, and ESD qualification.

  • Manufacturing: Experience working with fabrication and assembly partners on stack-up, via technology, and cost trade-offs.

  • Problem Solving: Rigorous, structured, and analytical; able to work autonomously and see a board from concept through to production.

  • Communication and Influence: Excellent written and verbal communication, able to present design and test results to engineers and senior stakeholders.

  • Additional Skills: FPGA or MPSoC design, prior work deploying AI inference on embedded targets, and UAS, drone, or defence hardware experience are strong advantages.

  • Commitment: 100% dedication to Harmattan AI's mission, vision, and ambitious growth plans, ready to go the extra mile to ensure operational excellence. Thrives in a fast-paced environment where priorities shift and no task is too small.

We look forward to hearing how you can help shape the future of autonomous defense systems at Harmattan AI.

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