Electrothermal Power Device Test Bench Design & Ageing

IFP Energies Nouvelles Group

Rueil-Malmaison

On-site

EUR 10,000 - 15,000

Full time

14 days+
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Job summary

IFP Energies Nouvelles Group in Rueil-Malmaison, France, offers a six-month internship to study and design a test bench for electrothermal characterisation and ageing of power devices. You will focus on back-to-back test bench development and measurement of conduction and switching losses under realistic thermal stresses.

The project includes reviewing current bench architecture, implementing improvements, and correlating power losses with thermal cycles.

Qualifications

  • Engineering student or final-year Master’s student with solid background in electrical engineering and power electronics.
  • Knowledge of power electronics and semiconductor devices (SiC, GaN).
  • Experience with MATLAB/Simulink, LTspice and PLECS is advantageous.
  • Interest in experimental validation and dissemination of results through publications.

Responsibilities

  • Develop a back-to-back test bench for power device characterisation.
  • Improve accuracy, reliability and repeatability of conduction and switching loss measurements.
  • Incorporate temperature sensitive electrical parameter measurements (TSEPs) for junction temperature estimation.
  • Monitor ageing-sensitive electrical parameters (Vth, Rds_on, switching times) during tests.
  • Provide experimental data to support modelling and reliability assessment.

Skills

Power electronics
Thermal modelling
Team collaboration
Experimental validation

Education

Electrical engineering / Master in EE

Tools

MATLAB/Simulink
LTspice
PLECS

Job description

IFP Energies Nouvelles Group in Rueil-Malmaison, France, offers a six-month internship to study and design a test bench for electrothermal characterisation and ageing of power devices. You will focus on back-to-back test bench development and measurement of conduction and switching losses under realistic thermal stresses.

The project includes reviewing current bench architecture, implementing improvements, and correlating power losses with thermal cycles.

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