Hardware Chapter Lead: Build & Grow Embedded Systems

NestAI; Tampere; On-site; EUR 120,000 - 180,000; Full time

Benefits offered by this job

Occupational healthcare

Regular team lunches and all-hands

Mac or PC choice

Holiday allowance

Phone benefit

Job summary

NestAI is seeking a HW Chapter Lead in Tampere to steer the hardware engineering discipline, drive a strong technical vision, and build a high-performing chapter. You will mentor engineers, align with product and architectural leaders, and ensure robust hardware platforms for NestAI’s open, interoperable NestOS platform.

The role emphasizes people leadership, strategic thinking, and deep technical breadth across embedded systems, PCB design, sensor integration, and rugged electronics.

Qualifications

• Proven leadership experience building and scaling hardware teams.
• Significant hands-on hardware experience early in your career.
• Excellent interpersonal and stakeholder management skills.
• Broad knowledge of embedded systems, PCB design, sensors, and rugged electronics.

Responsibilities

• Own and drive the hardware technical vision aligned with NestAI's strategic goals.
• Mentor, coach, and grow a high-performing hardware chapter.
• Support project goals by translating strategy into actionable targets.
• Lead recruitment for the hardware discipline and allocate resources across squads.
• Engage with customers as needed and ensure clear communication between product needs and engineering.

Skills

Leadership

People management

Hardware engineering

Embedded systems

PCB design

Sensor integration

Mechanical design

Job description

NestAI is seeking a HW Chapter Lead in Tampere to steer the hardware engineering discipline, drive a strong technical vision, and build a high-performing chapter. You will mentor engineers, align with product and architectural leaders, and ensure robust hardware platforms for NestAI’s open, interoperable NestOS platform.

The role emphasizes people leadership, strategic thinking, and deep technical breadth across embedded systems, PCB design, sensor integration, and rugged electronics.