Senior Thermal Engineer

Hireroo Ltd; Barcelona; Hybrid; EUR 90,000 - 120,000; Full time

Benefits offered by this job

Hybrid work model

Relocation bonus

Private medical insurance

Language classes

Job summary

Hireroo Ltd in Barcelona, Spain, seeks a Senior Thermal Engineer to own the thermal architecture for advanced compute hardware, from die to rack level, including liquid cooling and sled design. This senior IC role collaborates with mechanical, power and hardware teams in a hybrid Barcelona setting.

You will define thermal budgets, validate methods and drive CFD/thermal simulations, ensuring hot spots are controlled while supporting telemetry and power management decisions.

Qualifications

• 8+ years of electronics thermal engineering experience.
• Background in high power computing, data centres or similar electronics.
• Thermal ownership of processors, GPUs, ASICs or FPGAs.
• Strong package level thermal analysis.
• Strong CFD and thermal simulation experience.
• Icepak, Flotherm, Star CCM+ or equivalent.

Responsibilities

• Own thermal design from silicon to rack level.
• Define thermal budgets for high power compute hardware.
• Model die hotspots, package spreading and board level thermal behaviour.
• Run CFD and conjugate heat transfer simulations.
• Perform transient analysis using realistic workload power profiles.
• Design cold plates, manifolds and liquid cooling loops.
• Define flow rate, pressure drop and coolant requirements.
• Specify TIM stack, bond line and thermal interface requirements.
• Define sled and rack thermal architecture.
• Set coolant distribution, redundancy and failure response requirements.
• Own thermal validation on real hardware.
• Correlate simulation results with sensor and test measurements.
• Work with mechanical, power and cooling partners.
• Support thermal telemetry, throttling and power management decisions.

Skills

Electronics thermal engineering

CFD and thermal simulations

Thermal budget management

Liquid cooling design

Tools

Icepak

Flotherm

Star CCM+

Job description

Job Description

Our partner is looking for a Senior Thermal Engineer to own the thermal architecture for advanced compute hardware, from die and package level analysis through liquid cooling, sled design and rack level heat rejection.

This is a senior individual contributor role with strong technical ownership. You will define thermal budgets, cooling requirements and validation methods, working closely with mechanical, power and hardware teams.

Location: Barcelona, Spain, Hybrid
Level: Senior

Responsibilities

• Own thermal design from silicon to rack level

• Define thermal budgets for high power compute hardware

• Model die hotspots, package spreading and board level thermal behaviour

• Run CFD and conjugate heat transfer simulations

• Perform transient analysis using realistic workload power profiles

• Design cold plates, manifolds and liquid cooling loops

• Define flow rate, pressure drop and coolant requirements

• Specify TIM stack, bond line and thermal interface requirements

• Define sled and rack thermal architecture

• Set coolant distribution, redundancy and failure response requirements

• Own thermal validation on real hardware

• Correlate simulation results with sensor and test measurements

• Work with mechanical, power and cooling partners

• Support thermal telemetry, throttling and power management decisions

Requirements

• 8+ years of electronics thermal engineering experience

• Background in high power computing, data centres or similar electronics

• Thermal ownership of processors, GPUs, ASICs or FPGAs

• Strong package level thermal analysis

• Strong CFD and thermal simulation experience

• Icepak, Flotherm, Star CCM+ or equivalent

• Liquid cooling and cold plate design

• Flow and pressure budget experience

• TIM selection and bond line knowledge

• Thermal interface reliability understanding

• Practical thermal validation experience

• Strong simulation to measurement correlation skills

Optional / Desired

• 2.5D, interposer or chiplet thermal design

• Two phase cooling

• Immersion cooling

• Direct to chip cooling

• OCP rack cooling experience

• Facility water interface design

• Electro thermal simulation

• Power delivery or PDN collaboration

• Python for automation and test analysis

What’s in it for you?

• Flexible working hours

• Hybrid model, 4 days office, 1 day from home

• 1 week per year working from anywhere

• 25 days annual leave plus December 24 and 31

• Monthly food allowance

• Private medical insurance

• Relocation bonus

• Housing search support

• Visa support if required

• Family relocation support

• Virtual shares

• Language classes

• Tax incentive, subject to eligibility