Director of Field Applications Engineers; EU, UK, APAC

Baya Systems; España; Presencial; PHP 9.219.421 - 12.292.562; Jornada completa

Descripción de la vacante

Baya Systems is looking for a Director of Field Applications Engineering to lead a world-class team across Europe and the Asia-Pacific region. In this role, you will drive the technical adoption and integration of innovative fabric interconnect silicon IP, working closely with customers and cross-functional teams.

The ideal candidate will have at least 10 years of industry experience and a strong background in managing technical teams. Responsibilities include overseeing technical support, managing customer relationships, and delivering keynotes to C-level executives.

Formación

• 5+ years of experience managing customer-facing engineering teams.
• 10+ years in semiconductor or silicon IP sectors.
• Deep understanding of Network-on-Chip (NoC) and AMBA protocols.

Responsabilidades

• Lead a distributed team of senior Field Applications Engineers across EU and APAC.
• Recruit and onboard engineering talent in key regional hubs.
• Partner with regional sales directors to secure high-value design wins.

Conocimientos

Leadership in technical teams

Cross-cultural communication

Customer relationship management

Technical presentation skills

Educación

Bachelor’s degree in Electrical Engineering

Master’s degree or PhD in related field

Herramientas

EDA tools (Synopsys, Cadence, Siemens)

Descripción del empleo

Overview

Director, Field Applications Engineering (UK/EU/APAC)

Role Overview:

Lead and grow a world-class Field Applications Engineering (FAE) team across Europe and the Asia-Pacific region. You will drive the technical adoption, integration, and design-win pipeline for our next-generation fabric interconnect silicon IP. You will be responsible for both Pre AND Post sales support.

Role Details

• Position: Senior Manager, Field Applications Engineering
• Location: Remote (Based in the EU or the UK)
• Region Coverage: UK, Europe (EU) and Asia-Pacific (APAC)
• Travel: Up to 30-40% international travel required

Key Responsibilities

• Manage: Lead a distributed team of senior FAEs across EU and APAC.
• Hire: Recruit and onboard top-tier engineering talent in key regional hubs.
• Coach: Provide continuous technical mentorship and professional development.
• Align: Set clear regional goals aligned with corporate business objectives.
• Grow collaterals, to enable improved efficiency / ease of adoption by the customer

Technical Account Management & Sales Support

• Drive Strategy: Partner with regional sales directors to secure high-value design wins.
• Own Delivery: Act as the escalations point for critical customer technical issues.
• Guide Evaluation: Oversee customer proof-of-concepts, evaluations, and architectural reviews.
• Present: Deliver technical keynotes, deep-dives, and product demonstrations to C-level executives.
• Feedback Loop: Funnel regional customer requirements directly to internal R&D and Product Management.
• Influence Roadmap: Use market insights to shape the future fabric interconnect IP roadmap.
• Enablement: Create application notes, whitepapers, and training collateral for regional ecosystems.

Required Qualifications

Experience & Education

• Education: Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related STEM field.
• Management: 5+ years of experience managing customer-facing engineering teams (FAE or Technical Support).
• Industry: 10+ years in the semiconductor, silicon IP, or high-performance networking sectors.

Technical Expertise

• IP Knowledge: Deep understanding of Network-on-Chip (NoC), AMBA protocols (CHI, AXI, ACE), or PCIe/CXL fabrics.
• Design Flow: Familiarity with front-end ASIC design, SoC architecture, RTL verification, and EDA tools (Synopsys, Cadence, Siemens).
• Systems: Insight into AI/ML accelerators, data center architectures, and automotive SoC requirements.

Soft Skills & Logistics

• Communication: Exceptional English verbal and written communication skills.
• Cross-Cultural: Proven experience managing teams and clients across diverse cultures in Europe and Asia.
• Autonomy: Self-motivated style suited for a fast-paced, early-stage startup environment.

Preferred Qualifications

• Master’s degree or PhD in Electrical or Computer Engineering.
• Prior experience working in a fast-growing, venture-backed silicon IP startup.
• Existing technical relationships with major Tier-1 semiconductor and system companies in the EU and APAC.
• Additional language skills relevant to the covered regions (e.g., Mandarin, Japanese, Korean, German).