Board-Level Reliability Research Engineer - Simulation and Testing (m/f/d)

RxREVU, Inc.; München; Vor Ort; EUR 95.000 - 135.000; Vollzeit

Benefits dieser Stelle

Training opportunities

Company canteen meals

Diverse and international team

Opportunity to travel across Europe &

Zusammenfassung

Huawei Heisenberg Research Center (Munich) seeks a Board-level Reliability Research Engineer to advance simulation and testing for chip-package-board interactions. You will lead multi-physics simulations and non-destructive testing methods to ensure robust integration across platforms.

Responsibilities include developing new methodologies, planning reliability test programs, and collaborating with HQ and European partners.

Qualifikationen

• MS or higher in Mechanical or Electrical Engineering (PhD preferred).
• Experience in chip-to-package-board system simulations is essential.
• Strong knowledge of PCBA stress analysis and NDT methods.
• Excellent communication and cross-border collaboration skills.

Aufgaben

• Lead simulation and testing for CPBSI models and reliability.
• Develop new simulation and test technologies; validate them.
• Plan and execute reliability tests: thermal cycling, humidity, electrical tests.
• Collaborate with HQ and European resources; travel in Europe/China.

Kenntnisse

Multi-scale simulation

AI-assisted simulation

Non-destructive testing

Team collaboration

Travel willingness

Ausbildung

Master's degree in Mechanical Engineering

Master's degree in Electrical Engineering

PhD preferred

Tools

Python

Fortran

Finite Element Software

Jobbeschreibung

Huawei Heisenberg Research Center (Munich)

Huawei Heisenberg Research Center (Munich) is responsible for advanced technology research, architectural development, design and strategic engineering of our products.

Board-level Reliability Research Engineer, Simulation and Testing (m/f/d)

Job Summary:

As a Simulation and Testing Engineer, you will propose, develop and implement new methodologies that improve the reliability and robustness of chip-to-package and package-to-board integration. The role addresses challenges in material integration, thermo-mechanical response and system integration. Expertise in multi-scale and multi-physics simulation, together with non-destructive testing technologies, will be the key assets for driving these projects.

Key Responsibilities:

Simulation:

• Provide insights into new simulation technologies for large-scale CPBSI (chip-package-board-system interactions) models to improve efficiency and accuracy, such as model order reduction and AI-assisted simulation.
• Perform PCBA mechanical stress simulation of large-size chips and participate in test verification research. Collaborate in the research and development of new technologies that reduce PCBA stress reliability risk during product testing and assembly.

Reliability analysis and testing:

• Provide insights into non-destructive test technologies for simulation model validation and reliability design, including crack/delamination inside the package, the very thin bond line thickness between heatsink and chip, and in-situ stress/strain monitoring of the solder.
• Develop and execute reliability test plans for board-level package integration, including thermal cycling, mechanical stress, humidity, and electrical performance evaluation.

General responsibilities:

• Lead technology planning, advanced resource analysis, and cooperation with research and industry resources in Europe.
• Establish and validate new simulation and test technologies to solve challenges raised by HQ, and work with HQ colleagues to apply these methods in real application scenarios.

Your areas of expertise

• M.S. or higher in Mechanical or Electrical Engineering (PhD preferred).
• Deep understanding of the simulation and characterization challenges in complex electronic systems with chip-package-board-system interactions.
• At least one of the following: experience in stress simulation of PCBA and mechanical components/assemblies; experience with commercial finite element simulation tools; experience with non-destructive testing of failures/stress/strain or knowledge of the underlying physical principles. Experience in model order reduction, AI-assisted simulation and coding (Python, Fortran, etc.) is a plus.
• Established relationships with research and industrial resources in Europe for simulation and testing, or willingness to build them.
• Able to work both in a team and independently, comfortable in a diverse team, with good communication skills and willingness to travel in Europe and China.
• Fluent English required.

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Your rewards of working here

• Our culture is characterized by innovative power and team spirit as well as the intensive exchange of knowledge and experience within our global network.
• We offer healthy meals ranging from traditional Chinese to western delicacies in our famous company canteen.
• To keep your development ongoing, you will find a broad range of training opportunities. Many online and face-to-face training programs incl. language courses in German and Mandarin.
• Our diverse and welcoming environment is shaped by different backgrounds and around 40 individual nationalities.
• Self-responsible work in a competent, motivated and constantly growing team.

Huawei is a leading global information and communications technology (ICT) solutions provider. Our ICT solutions, products and services are used in more than 170 countries and regions, serving over one-third of the world's population. With 208,000 employees, Huawei is committed to develop the future information society and build a Better Connected World.

Department Precision Module and Equipment Laboratory (Heisenberg Research Center) Locations Huawei Heisenberg Research Center (Munich)