Packaging Manager

microTECH Global LTD; Zürich; On-site; CHF 180,000 - 280,000; Full time

Job summary

microTECH Global LTD in Zürich seeks a Senior Packaging Manager - Production Engineering to lead and grow a high-performing team responsible for semiconductor production, assembly, test and packaging. You will own production readiness, industrialisation and ramp-up for new products across multiple fabs and OSATs.

This role combines technical leadership with strategic manufacturing responsibility, driving yield improvements, cost reductions and rapid time-to-market while collaborating with

Qualifications

• University degree in Electrical Engineering, Microelectronics, Materials Science, Mechanical Engineering or related technical discipline.
• Several years of experience within semiconductor production, assembly, test and/or packaging engineering.
• Proven experience leading, coaching and developing technical engineering teams.
• Strong understanding of IC manufacturing flows, yield management and production ramp-up.
• Experience working with external manufacturing partners, including fabs, OSATs and test houses.
• Structured, analytical and data-driven problem solving.
• Excellent communication and stakeholder management skills.
• Experience working in a fast-paced, high-volume semiconductor manufacturing environment.
• Fluent English; German language skills would be advantageous.

Responsibilities

• Lead, coach and develop a team of Production and Package Engineers.
• Provide technical direction and support the professional development of the engineering team.
• Own production readiness, industrialisation and high-volume ramp-up for new products across assembly and test.
• Drive yield improvement, cost reduction and production capability enhancements across manufacturing operations.
• Lead the resolution of production issues, including yield excursions, equipment-related challenges and reliability risks.
• Oversee package development activities, ensuring reliability, performance, quality and manufacturability targets are achieved.
• Manage and develop relationships with external manufacturing partners, including fabs, OSATs and test houses.
• Ensure robust documentation, change control and alignment of production and package specifications across the organisation and supply chain.
• Work cross-functionally with Engineering, Operations, Quality, Product Development and external suppliers.
• Support continuous improvement and manufacturing optimisation initiatives.

Skills

Team leadership

Production engineering

Semiconductor manufacturing

Yield management

Industrialisation

Problem solving

Stakeholder management

Cross-functional collaboration

Data-driven decisions

English fluency

Education

Electrical Engineering / Microelectronics / Materials Science / Mechanical Engineering degree

Job description

Senior Packaging Manager - Production Engineering

A leading global semiconductor technology company is seeking an experienced Senior Packaging Manager - Production Engineering to lead and develop a high-performing engineering team responsible for semiconductor production, assembly, test and packaging. This is a key leadership position combining technical expertise, people management and strategic manufacturing responsibility, with significant influence over production readiness, industrialisation, yield, cost and time-to-market.

The Role:

As Senior Manager, you will lead a team of Production Engineers and Package Engineers, providing both technical direction and strong people leadership. You will play a central role in ensuring stable, high-yield and cost-effective semiconductor manufacturing across a global supply chain. You will be responsible for driving new product industrialisation through to high-volume production, while working closely with internal teams and external manufacturing partners.

Key Responsibilities:

• Lead, coach and develop a team of Production and Package Engineers.
• Provide clear technical direction and support the professional development of the engineering team.
• Own production readiness, industrialisation and high-volume manufacturing ramp-up for new products across assembly and test.
• Drive yield improvement, cost reduction and production capability enhancements across manufacturing operations.
• Lead the resolution of production issues, including yield excursions, equipment-related challenges and reliability risks.
• Oversee package development activities, ensuring reliability, performance, quality and manufacturability targets are achieved.
• Manage and develop relationships with external manufacturing partners, including fabs, OSATs and test houses.
• Ensure robust documentation, change control and alignment of production and package specifications across the organisation and supply chain.
• Work cross-functionally with Engineering, Operations, Quality, Product Development and external suppliers.
• Support continuous improvement and manufacturing optimisation initiatives.

Your Background:

• A University degree in Electrical Engineering, Microelectronics, Materials Science, Mechanical Engineering or a related technical discipline.
• Several years of experience within semiconductor production, assembly, test and/or packaging engineering.
• Proven experience leading, coaching and developing technical engineering teams.
• Strong understanding of IC manufacturing flows, yield management and production ramp-up.
• Experience working with external manufacturing partners, including fabs, OSATs and test houses.
• A structured, analytical and data-driven approach to problem solving.
• Excellent communication and stakeholder management skills.
• Experience working within a fast-paced, high-volume semiconductor manufacturing environment.
• Fluent English is essential; German language skills would be advantageous.