Senior Mechanical Engineer (Semiconductor Packaging)

InPho; Ottawa; On-site; CAD 150,000 - 200,000; Full time

Benefits offered by this job

Health benefits

Equity

Flexible work environment

Career growth

Job summary

Inpho is seeking a Senior Mechanical Engineer to lead the mechanical lifecycle of optical subassemblies and bring them to the global market. You will own the mechanical design, testing, and scaling processes from prototype to mass production, ensuring robustness for telecom and datacom applications.

You will collaborate with packaging, electrical, optical, and production teams to optimize thermal management, reliability, and manufacturability across the product lifecycle.

Qualifications

• Bachelor’s or Master’s degree in mechanical engineering, engineering physics or materials science and engineering.
• 7+ years (with a Bachelor’s) or 5+ years (with a Master’s) of industrial development experience in semiconductor
• Advanced proficiency in CAD for 3D design and 2D drawings with GD&T expertise
• Proven track record designing micro-alignment tooling and lab fixtures for optoelectronic/semiconductor assemblies
• Hands-on BOM management and product data/document management experience (SolidWorks PDM)
• DFMEA involvement and collaboration with FA teams on mechanical defects
• Knowledge of semiconductor packaging concepts, thermal-mechanical constraints, and materials selection
• Strong understanding of ISO/ANSI mechanical design standards and Telcordia GR468 for telecom/datacom equipment
• Excellent English communication skills

Responsibilities

• Lead end-to-end mechanical design of optomechanical components using CAD tools.
• Perform 3D tolerance stack-ups and apply GD&T per ASME Y14.5.
• Design high-precision fixtures and test setups for R&D and production.
• Support packaging design focusing on thermal management and reliability.
• Develop automation scripts to enable benchtop testing and measurements.
• Manage multi-level BOMs and product configurations in a PDM system.
• Prototype, test, and validate parts in the R&D lab.
• Partner with DFMEA and FA teams on failure analysis.
• Collaborate with vendors, OSATs, and cross-functional teams to transfer components to production.

Skills

CAD mastery

GD&T

Tolerance analysis

DFMEA & FA

Semiconductor packaging

BOM & data management

Test automation scripting

Mechanical design

Communication

Education

Bachelor’s or Master’s degree in mechanical engineering or related field

Tools

SolidWorks

Creo

SolidWorks PDM

Python / LabVIEW scripting

Job description

About Inpho

Inpho is a fast-growing startup, focused on developing cutting-edge optoelectronic solutions for next-generation communications, and photonic systems. Our multidisciplinary team is pushing the boundaries of innovation in integrated photonics and semiconductor packaging.

Inpho’s new class of electro-photonic chips is poised to revolutionize and disrupt the optical interconnect market. Utilizing this new class of chips enables existing optical interconnect systems to be built at much lower cost; new architectures to be deployed that provide significantly higher price/performance; and a whole new generation of higher speed interconnect to be built that to date have been impossible.

About the Role

We are looking for a Senior Mechanical Engineer who thrives at the intersection of precision design and robust process development to help us bring our optical subassemblies to the global market. You will own the mechanical lifecycle of our optical subassemblies and will be responsible for how our products are built, tested, and scaled. You will bridge the gap between initial optoelectronic design and reliable prototyping and mass production, ensuring our hardware meets the rigorous demands of the telecom and datacom industry.

Key Responsibilities

• Mechanical Design: Lead the end-to-end physical design of sophisticated optomechanical components and assemblies using CAD tools (SolidWorks).
• Tolerance Budgeting & GD&T: Perform 3D tolerance stack-up analyses and apply Geometric Dimensioning and Tolerancing (GD&T per ASME Y14.5) to define precise models and manufacturing drawings for micro-scale optical assemblies.
• Precision Tooling & Fixture Development: Design high-precision custom test setups and assembly fixtures to support R&D lab for prototype build and electro-optical characterizations, as well as production line for high-volume manufacturing.
• Semiconductor Packaging: Support Designing and optimizing semiconductor/optoelectronic packaging design, focusing on thermal management, material selection and structural integrity.
• Test Automation & Scripting: Develop custom automation scripts and control software (e.g., Python, LabVIEW, or VBA/SOLIDWORKS macros) to automate benchtop test fixtures and electro-optical measurement workflows.
• BOM and PDM Management: Manage multi-level Bills of Materials (BOMs) and product configuration structures within Product Data Management (PDM) system, ensuring accuracy throughout the product lifecycle and coordinating with procurement.
• Prototyping & Validation: Take a hands-on approach to building, testing, and validating parts and assemblies in the R&D lab.
• DFMEA & Failure Analysis (FA): Partner with internal and external reliability and FA experts to conduct DFMEA and perform root-cause analysis on mechanical/packaging failure modes during prototype builds.
• Vendor & OSAT Collaboration: Collaborate with machining vendors, tooling suppliers and OSAT partners to oversee component fabrication and qualification and facilitate the seamless transfer of components from R&D to production.
• Cross-Functional Collaboration: Partner daily with packaging, electrical, optical, and production engineers as well as operations team to solve complex opto-mechanical design and integration challenges.

Qualifications

• Education: Bachelor’s or Master’s degree in mechanical engineering, engineering physics or materials science and engineering.
• Experience: 7+ years (with a Bachelor’s degree) or 5+ years (with a Master’s degree) of validated industrial development experience in semiconductor industry.
• CAD Mastery and Tolerance Analysis: Advance proficiency in CAD tools for 3D model design and 2D drawings creation (using SolidWorks or Creo) with demonstrated expertise in GD&T and tolerance analysis.
• Precision Fixturing Design and Fabrication: Proven track record designing custom micro-alignment tooling and lab fixtures for small-form-factor optoelectronic/semiconductor assemblies, as well as strong understanding of metal fabrication and machining processes.
• BOM and Data Management: Hands-on experience managing BOMs and proven experience with product document management and version control platforms, specifically with SolidWorks PDM.
• DFMEA & Reliability Collaboration: Hands-on experience participating in DFMEA risk mitigation and collaborating with failure analysis (FA) teams on material/mechanical defect resolution.
• Semiconductor Packaging and Manufacturing Knowledge: Working knowledge of semiconductor packaging design concepts and thermal-mechanical constraints, as well as understanding of manufacturing methods and materials selection specific to the photonics and optoelectronics packaging industry.
• Standards: Deep understanding of mechanical design standards (ISO, ANSI) and Datacom/Telecom equipment qualification standards (Telcordia GR468).
• Communication: Excellent English verbal and written communication skills; ability to effectively convey complex technical concepts to diverse stakeholders.

Preferred Qualifications

• Optical Alignment Systems: Experience with high-precision motion control stages, Thorlabs/PI alignment hardware, or automated optical bench setups.
• Test Automation Scripting: Proficiency in programming/scripting languages (Python, LabVIEW, or VBA/macros) for test automation and data acquisition.

Why Join Inpho?

• Be part of a mission-driven startup shaping the future of photonics.
• Competitive salary, full health benefits and equity packages, flexible work environment, and career growth opportunities.

Come work with a dynamic, high-talent team to build and commercialize the highest performance photonics chips in the world!

Additional Information

This posting is for a newly created position.

The expected compensation range for this position is CAD$150,000 - $200,000 annually. Actual compensation offered for this position will be determined based on a variety of factors, including the candidate’s skills, level, experience, qualifications, and overall fit for the role.

Inpho may use Artificial Intelligence (AI) to support aspects of the recruitment process, including candidate screening and assessment. All final hiring decisions are made by Inpho’s Hiring Team.

Inpho is an equal opportunity employer committed to fostering an inclusive, diverse, and respectful workplace. We provide equal employment opportunities without discrimination based on race, colour, religion, sex, gender identity or expression, sexual orientation, national origin, age, disability, veteran status, or any other characteristic protected by applicable law.

If you require accommodation during the recruitment process, please contact Inpho Human Resources at [e-mail]

We thank all candidates for their interest in Inpho. Only those candidates selected for an interview will be contacted.