Senior Mechanical Engineer – Chassis & Enclosures Leader

Broadcom Inc.

Ottawa

On-site

CAD 114,000 - 183,000

Full time

3 days ago
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Benefits offered by this job

Discretionary yearly bonus
Equity grants
RRSP matching
ESPP
Paid holidays & vacation

Job summary

Broadcom Inc. in Ottawa, Canada seeks a Principal Mechanical Engineer to design, develop, and deliver mechanical assemblies including full chassis design for high-performance products. You will provide technical leadership to a small design team and own all mechanical aspects from BOM to manufacturing handoff.

You will collaborate with cross-functional teams (Hardware, ASIC, Thermal, Packaging, Manufacturing) and support customer trials, field issues, and sustaining efforts post-launch.

Qualifications

  • Bachelor's degree in Mechanical Engineering with 12+ years of related experience.
  • Experience designing high-powered enclosures for cooling 2kW/RU+ with PCB footprints 1kW+.
  • Knowledge of US/European/Asian standards for safety and environmental requirements.
  • Lifecycle product ownership from inception to volume production.

Responsibilities

  • Own all aspects of mechanical design, including BOM creation and vendor interaction.
  • Provide technical leadership to a small design team and mentor junior engineers.
  • Lead design for manufacturability (DFM) and ensure smooth transitions from design to production.
  • Support customer trials, field issues, and product sustaining after ship.

Skills

Thermal management
Cross-functional collaboration
Regulatory compliance
Lifecycle ownership
Team leadership
DFM

Education

Bachelor's degree in Mechanical Engineering

Job description

Broadcom Inc. in Ottawa, Canada seeks a Principal Mechanical Engineer to design, develop, and deliver mechanical assemblies including full chassis design for high-performance products. You will provide technical leadership to a small design team and own all mechanical aspects from BOM to manufacturing handoff.

You will collaborate with cross-functional teams (Hardware, ASIC, Thermal, Packaging, Manufacturing) and support customer trials, field issues, and sustaining efforts post-launch.

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