Senior Electronics Designer

flir; Southwestern Ontario; On-site; CAD 134,000 - 178,000; Full time

Benefits offered by this job

Competitive compensation

Comprehensive health benefits

Retirement savings plan with company 1

Educational assistance

Career development support

Job summary

Teledyne Digital Imaging seeks a Sr. Electronics Designer to lead multi-discipline electronics design efforts for space-grade imaging platforms. You will own FPA/camera architectures, guide PCB layout, and drive robust, testable designs for high-reliability space applications.

Ideal candidates have 8+ years in space hardware and experience with ADC/DAC, FPGAs, and mixed-signal design, with strong collaboration across firmware, mechanical, and test teams. Equal opportunity employer.

Qualifications

• Space hardware design experience for LEO applications preferred.
• Familiarity with NASA, ESA, MIL spec requirements.
• Strong, demonstrated expertise in digital and analog circuit design.
• Experience with PCB design tools and lab instrumentation (high-speed scope, thermal chambers).
• Strong working knowledge of high-speed digital, mixed-signal, and power electronics design.
• Experience with ADCs, DACs, SMPS, LDOs, op-amps, FPGAs, microcontrollers, and fiber optics.
• Proven ability to own complex technical problems and deliver solutions independently.
• Ability to influence technical direction and collaborate across multiple teams.
• Minimum Bachelor degree in Electrical Engineering or related field.
• Typically 8+ years of relevant experience.

Responsibilities

• Lead the design and development of Focal Plane Array (FPA) and Camera platforms for Low Earth Orbit (LEO) imaging applications.
• Own board-level architecture decisions including power, signal integrity, high-speed interfaces, grounding.
• Define PCB stackups and guide layout strategy for complex, high-performance designs with emphasis on SI and EMI control.
• Drive design optimization for cost, reliability, manufacturability, scalability, and testability, including space-rated/radiation-tolerant components.
• DFM and DFT considerations at the design level.
• Independently debug, validate, and qualify designs through prototype and production stages.
• Provide technical leadership across firmware, FPGA, mechanical, thermal, and test teams.
• Lead design reviews and ensure adherence to engineering standards and best practices.
• Mentor intermediate and junior designers, providing technical guidance and developmental feedback.
• Identify technical risks early and implement mitigation strategies across projects.
• Support production ramp-ups and resolve escalated field or manufacturing issues.
• Oversee design tasks with external labs for EMC testing and Thermal Analysis.

Education

Bachelor9s degree in Electrical Engineering

Tools

Siemens PADS

Oscilloscope

Thermal chamber

Job description

Be visionary

Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.

We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.

Job Description

Our Company is built on employee mutual commitment and respect, enthusiasm and progress.

Teledyne Digital Imaging is a subsidiary of Teledyne Technologies Inc., a U.S. publicly listed enterprise, and specializes in the manufacture, design, research and development of high-performance CMOS and CCD image sensors and modular expandable cameras. Teledyne Digital Imaging's products are used worldwide in machine vision, document scanning, image capture, surveillance, process monitoring, manufacturing inspection, medical imaging, and multimedia.

As part of our continuing growth in this high technology market, Teledyne Digital Imaging is recruiting for a Sr. Electronics Designer ! If you’re passionate about electronics design and want to work where cutting-edge meets real-world impact, this is your opportunity!

What you'll do

• Work on a multidisciplinary team consisting of software, mechanical, optical, FPGA, and systems design as a senior electronics designer.
• Lead the design and development of Focal Plane Array (FPA) and Camera platforms for Low Earth Orbit (LEO) imaging applications.
• Own board‑level architecture decisions including: power, signal integrity, high‑speed interfaces, grounding
• Define PCB stackups and guide layout strategy for complex, high‑performance designs, with emphasis of signal integrity and EMI control
• Drive design optimization for cost, reliability, manufacturability, scalability, and testability, including the special requirements for space rated/ radiation tolerant components.
• DFM and DFT considerations at the design level.
• Independently debug, validate, and qualify designs through prototype and production stages.
• Provide technical leadership across firmware, FPGA, mechanical, thermal, and test teams.
• Lead design reviews and ensure adherence to engineering standards and best practices.
• Mentor intermediate and junior designers, providing technical guidance and developmental feedback.
• Identify technical risks early and implement mitigation strategies across projects.
• Support production ramp‑ups and resolve escalated field or manufacturing issues
• Comfortable working with external labs/specialists as needed to oversee design tasks such as EMC testing, and Thermal Analysis.

What you need

• Previous space hardware design experience for LEO applications preferred.
• Familiarity with NASA, ESA, MIL spec requirements.
• Strong, demonstrated expertise in digital and analog circuit design.
• Experience with PCB design tools (e.g., Siemens PADS) and lab instrumentation such as high-speed scoped and thermal chambers.
• Strong working knowledge of high‑speed digital, mixed‑signal, and power electronics design.
• Extensive experience with ADCs, DACs, SMPS, LDOs, op‑amps, FPGAs, microcontrollers, and fiber optics.
• Proven ability to own complex technical problems and deliver solutions independently.
• Ability to influence technical direction and collaborate across multiple teams.
• Minimum Bachelor’s degree in Electrical Engineering or related field required.
• Typically 8+ years of relevant experience.

What we offer

• Competitive compensation and comprehensive health benefits
• Progressive vacation plan and paid holidays
• Retirement savings plans with company match
• Educational assistance and career development support
• Opportunities to work on globally impactful technologies

This position is being posted in response to an existing vacancy within our organization

Teledyne Digital Imaging does not use AI tools to assist in the Screening, Assessing and Selecting of candidates for this role

Salary Range

$93,700.00-$124,900.000

The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, local regulations (such as minimum wage), education/training, work experience, key skills, and type of position.

Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.

Teledyne is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non‑merit based factor made unlawful by federal, state, or local laws.