Semiconductor Packaging Modeling and Simulation Engineer

onsemi; Southwestern Ontario; On-site; CAD 109,000 - 180,000; Full time

Benefits offered by this job

Competitive benefits package

Job summary

onsemi is seeking a self-driven packaging modeling and simulation engineer based in Waterloo, Ontario. You will work on thermal-mech simulations for microelectronic packaging and analyze reliability issues related to thermal performance across new power module development.

The role requires advanced degrees and 2–3+ years of relevant experience, with strong skills in ANSYS, SolidWorks, and non-linear mechanics. Competitive salary and benefits are offered.

Qualifications

• Master or PhD in Physics, Mechanical Engineering, Computational Mechanics, Solid Mechanics or Materials; Ph.D. preferred.
• 2–3+ years of relevant experience in thermal-mech modeling.
• Familiar with semiconductor packaging and material thermal-mech properties.
• Experience with CAD concepts and SolidWorks.
• Strong English communication and problem-analysis skills.

Responsibilities

• Perform thermal-mech simulations for microelectronic packaging and assemblies.
• Analyze reliability issues linked to thermal problems.
• Correlate modeling results with empirical data.
• Develop and maintain state-of-the-art thermal-mech modeling methodologies.
• Set up and maintain HW/SW environment for thermal modeling.
• Provide guidance to other users in the company.
• Innovate through simulation; explore Digital Twin, AI, and related methods.

Skills

Thermal-mech modeling

Crystal plasticity

Nonlinear solid mechanics

FEM/ANSYS

Problem analysis

Unix/Linux

Teamwork

Education

Master/PhD in Physics/Mechanical Engineering/Computational Mechanics

Tools

ANSYS Mechanical APDL/Workbench

SolidWorks

Job description

Job Summary:

onsemi is seeking a self-driven and motivated professional to join their Corporate R & D modeling and simulation team, located in Waterloo, Ontario N2V 1KB, Canada. As a semiconductor packaging modeling and simulation engineer, you will have the opportunities to support new power module development and new product design, assembly and process, quality and reliability, and customers in worldwide.

Performance Objectives:

• Do thermal-mech simulation for microelectronic packaging and system, assembly process such as Ag sintering and Cu sintering
• Analyze existing packages of reliability issues that are induced by thermal problems.
• Do analysis and correlation of thermal mech modeling results to measured data
• Develop and maintain the state of art thermal mech modeling methodology to improve the modeling work efficiency and accuracy
• Setup and maintain the HW/SW environment for thermal modeling
• Provide support to other thermal mech modeling users in the company
• Innovation of new technology through simulation
• Develop the state of art simulation methodology such as Digital Twin, AI and machine learning algorithm, crystal plasticity model, Ag and Cu sintering model, probability and optimization algorithm for component and system level models

Requirements:

• Master or PhD degree in Physics, Mechanical Engineering, Computational Mechanics, Solid Mechanics or Materials . Ph.D is preferred
• Knowledge and experience on thermal, mech modeling as well as crystal plasticity, and Cu/Ag sintering process
• Knowledge and experience of CAD concepts and Solidworks
• Familiar with semiconductor packaging
• Familiar with material thermal mech properties
• Strong knowledge of problem analysis and diagnosis technique
• 2-3+ years of relevant experience
• Deep knowledge of non-linear solid mechanics, fracture mechanics and delamination
• Familiar with package test and analysis, quality assurance, and reliability methods
• Ability to perform model correlation to empirical measurement
• Familiar with the Unix/Linux operating system
• Familiar with FEA software ANSYS Mechanical APDL/Work Bench
• Strong English communication capability
• Strong learning capability
• Good team player

onsemi (Nasdaq: ON) is driving energy efficient innovations, empowering customers to reduce global energy use. The company is a leading supplier of semiconductor-based solutions, offering a comprehensive portfolio of energy efficient power and signal management, logic, standard and custom devices. The company’s products help engineers solve their unique design challenges in automotive, communications, computing, consumer, industrial, medical and military/aerospace applications. ON Semiconductor operates a responsive, reliable, world-class supply chain and quality program, and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe and the Asia Pacific regions.

onsemi is excited to share the base salary range for this position is $76,900.00 to $127,000.00. Range exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of internal equity of our current team members. We also offer a competitive benefits package.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.

onsemi is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, ethnicity, color, religion, ancestry, national origin, age, marital status, pregnancy, sex, sexual orientation, physical or mental disability, medical condition, genetic information, military or veteran status, gender identity, gender expression, or any other protected category under applicable federal, state, or local laws.

If you are an individual with a disability and require a reasonable accommodation to complete any part of the application process, or are limited in the ability or unable to access or use this online application process and need an alternative method for applying, you may contact [e-mail] for assistance.