Research Scientist

Qnity; Kingston; On-site; CAD 114,000 - 180,000; Full time

Job summary

Qnity is seeking a Research Scientist – Mechanical Engineering to lead a research program in thermal materials for advanced electronics. You will drive heat-transfer performance, scale-up processes, and collaborate across teams to deliver next-generation TIMs, heat spreaders, and thermally conductive composites.

The role emphasizes translating research into commercial thermal solutions, mentoring engineers, and managing project milestones within budget and safety standards.

Qualifications

• Ph.D. in Mechanical Engineering (preferred) with 3–7 years of R&D in thermal materials or management.
• Post-doctoral experience in thermal sciences or electronics cooling is an asset.
• Strong fundamentals: heat transfer, conduction, convection, phase change.
• Thermal modeling and simulation using FEM/CFD tools.
• Experience with TIMs, gap fillers, and thermally conductive composites.
• Knowledge of semiconductor packaging and electronics cooling is desirable.
• Ability to translate research into commercial thermal solutions.
• Excellent project management and leadership skills.
• Strong communication and collaboration across cross-functional teams.

Responsibilities

• Provide technical leadership for planning and executing an R&D program in thermal materials engineering.
• Plan and execute scale-up for thermal materials for electronics and semiconductors.
• Develop and analyze intellectual property and patent landscapes related to thermal solutions.
• Collaborate with cross-functional teams to develop next‑generation thermal management solutions.
• Mentor team members and manage milestones, budgets, and deliverables.

Skills

Heat transfer

Thermal modeling

Thermal characterization

Electronics cooling

Structure–property relationships

Materials processing

Project leadership

Mentorship

Education

Ph.D. in Mechanical Engineering (preferred)

Post-doctoral experience in thermal sciences or electronics cooling (asset)

Tools

ANSYS

COMSOL

CFD

Job description

Are you looking to power the next leap in the exciting world of advanced electronics? Do you want to help solve problems that drive success in the rapidly evolving technology and connectivity landscape? Then bring your problem-solving, passion, and creativity to help us power the next leap in electronics.

At Qnity , we’re more than a global leader in materials and solutions for advanced electronics and high-tech industries – we’re a tight-knit team that is motivated by new possibilities, and always up for a challenge. All our dedicated teams contribute to making cutting-edge technology possible. We value forward-thinking challengers, boundary-pushers, and diverse perspectives across all our departments, because we know we play a critical role in the world enabling faster progress for all. Learn how you can start or jumpstart your career with us.

Research Scientist – Mechanical Engineering (Thermal Materials for Electronics & Semiconductors)

The successful candidate will provide technical leadership in planning and executing a comprehensive research and development program, including scale-up, focused on thermal materials engineering, heat transfer, and mechanical design for advanced electronics and semiconductor applications . This work will be driven by both internal and external customer needs, particularly in high-performance and miniaturized electronic systems.

Working collaboratively within cross-functional project teams, the candidate will contribute to the development of next-generation thermal management solutions , including thermal interface materials (TIMs), heat spreaders, encapsulants, and advanced composite systems aligned with key business objectives.

A core responsibility of this role is to identify and create commercial value in thermally functional materials and systems by leveraging deep expertise in heat transfer, thermal conductivity enhancement, and structure–property–performance relationships in engineered materials.

The candidate will play a critical role in developing and analyzing intellectual property and patent landscapes related to emerging thermal solutions for semiconductor packaging, power electronics cooling, and high-density electronic assemblies, identifying opportunities for innovation and protection of novel technologies.

Strong project management capabilities are essential to ensure that objectives, milestones, and deliverables are achieved on time and within budget, while adhering to the organization’s Foundational Principles.

In addition, the candidate will foster a positive and collaborative work environment by providing technical leadership and mentorship to team members. The role requires a high degree of initiative, with the ability to work independently and drive complex thermal engineering challenges under minimal supervision.

Qualifications

• Ph.D. in Mechanical Engineering (preferred), Materials Engineering, Chemical Engineering, or closely related discipline with 3–7 years of R&D experience in thermal materials or thermal management technologies .

• Post-doctoral experience in thermal sciences, electronics cooling, or advanced materials is considered an asset.

• Strong fundamentals in:

• Heat transfer (conduction, convection, phase change)

• Thermal modeling and simulation (e.g., FEM/CFD tools such as ANSYS, COMSOL, or equivalent)

• Thermal characterization techniques (e.g., laser flash, DSC, TGA, IR thermography)

• Demonstrated expertise in thermal interface materials (TIMs), gap fillers, phase-change materials, dielectric materials, or thermally conductive composites for electronics applications.

• Experience with semiconductor packaging, power electronics cooling, or high-performance computing thermal challenges is highly desirable.

• Knowledge of structure–property relationships in thermally conductive materials, including particle-filled systems, hybrid materials, and anisotropic heat conduction designs.

• Experience with materials processing and manufacturing techniques such as mixing, dispersion, coating, curing, and interface engineering.

• Strong desire to translate research into commercial thermal solutions, with a results-oriented mindset.

• Excellent project management, planning, prioritization, and leadership skills.

• Strong interpersonal, communication, and presentation skills, with the ability to engage both technical and non-technical stakeholders.

• Advanced analytical and technical problem-solving skills, including data interpretation and modeling.

• Demonstrated mentorship or team leadership experience is an asset; familiarity with product development and business processes is beneficial.

• Ability to work effectively both independently and within interdisciplinary teams, with an unwavering commitment to safety and engineering excellence.

Join our Talent Community (https://careers.qnityelectronics.com/us/en/jointalentcommunity) to stay connected with us!

Qnity is an equal opportunity employer. Qualified applicants will be considered without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability or any other protected class. If you need a reasonable accommodation to search or apply for a position, please visit our Accessibility Page for Contact Information (https://www.qnityelectronics.com/accessibility.html) .

Qnity offers a comprehensive pay and benefits package. To learn more visit the Compensation and Benefits page (https://careers.qnityelectronics.com/us/en/compensation-and-benefits-final) .

This posting is for an existing vacancy.

We use Artificial Intelligence (AI) to enhance our recruitment process.

The Pay range for this role is $80,150.00 - $125,950.00 Annual

How Base Pay is Determined: Qnity has job leveling frameworks that help organize roles based on progressive levels of responsibility, proficiency and qualifications. Each role has an associated pay range (or an established pay rate for some roles) based on the competitive market in each country where we operate. Each individual’s pay is based on a variety of factors, including their role and the associated pay range for that role, their geographic location (i.e., country, state, metropolitan area), as well as their skills, experience, education and certifications, and performance.