Principal Engineer- Packaging

Microchip Technology; Burnaby; On-site; CAD 90,000 - 120,000; Full time

Job summary

Join a leading technology company as an Advanced Packaging Engineer. You will work closely with design teams to innovate and optimize packaging technologies, driving performance across products. This role offers significant career growth opportunities within a supportive culture focused on employee development.

Benefits

Health benefits from day one

Quarterly bonuses

Retirement plans

Restricted stock units

Industry-leading IESPP program

Qualifications

• 8.5+ years’ experience in packaging with emphasis on Advanced Packaging.
• Experience with reliability, modeling, and testing of Advanced Packaging.

Responsibilities

• Work with design teams on Advanced Packaging technology.
• Collaborate to optimize power, signal, and thermal performance.

Skills

Problem-solving

Communication

Education

Bachelor's degree in Electrical Engineering

Master's or PhD

Tools

Cadence APD

Ansys Workbench

Flotherm

Job description

Are you looking for a unique opportunity to be a part of something great? Want to join a 20,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology, Inc.

People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally-recognized Leadership Passage Programs support career growth, enrolling over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and a strong sense of community, driven by our core values, which have earned us awards for diversity and workplace excellence.

Our company is built by dedicated team players who love to challenge the status quo; we achieved record revenue and growth thanks to a great team dedicated to empowering innovation. People like you.

Visit our page to see what exciting opportunities and company await!

Job Description :

The successful candidate will engage in the following duties :

1. Work with design teams to determine the best Advanced Packaging technology for Microchip's products.
2. Define flows for signal, power, and thermal analysis for advanced packaging, including working with EDA vendors to determine the best tools and flows for our designs.
3. Collaborate closely with design and architecture teams to optimize power, signal, and thermal performance of designs.
4. Lead integration-driven innovations across geographically dispersed teams in advanced packaging for Microchip products.

Requirements / Qualifications :

Education :

• Must have 8.5+ years’ experience in packaging with emphasis on Advanced Packaging.
• Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or Physics (Master's or PhD preferred).

Job requirements :

• Experience with package routing and layout using Cadence APD or similar tools.
• Knowledge of thermal and electrical simulations, ideally with Ansys Workbench, Flotherm.
• Ability to run Signal Integrity and Power Integrity simulations.
• Experience with Advanced Packaging concepts and technologies.
• Experience with reliability, modeling, and testing of Advanced Packaging.
• Broad knowledge of 3D and heterogeneous assembly technologies such as HBM / CoWoS.
• Understanding of semiconductor physics and processes is a plus.
• Problem-solving skills and ability to work with Die teams to iterate on package design.
• Excellent communication skills and team collaboration in a fast-paced environment.
• Self-motivated with attention to detail, capable of preparing technical reports and specifications.

Travel Time : 0% - 25%

Pay Range :

We offer a competitive total compensation package including base pay, restricted stock units, quarterly bonuses, health benefits from day one, retirement plans, and an industry-leading IESPP program. The annual base salary range depends on factors like location, skills, and experience.