Microelectronic Packaging Design Engineer

Sanmina-SCI Systems de México; Ottawa; On-site; CAD 85,000 - 120,000; Full time

Job summary

A leading company in the technology sector is seeking a Microelectronic Packaging Design Engineer to join their innovative team. You will work on cutting-edge microelectronics projects involving design and product development from concept to manufacturing. The ideal candidate will hold a Bachelor’s degree and have significant experience in the field, particularly in packaging for RF and optical applications.

Qualifications

• 5+ years of relevant experience in electronic hardware design.
• Experience in Wafer Level Packaging and Chip Scale Packaging.
• Proficient in computer aided design tools.

Responsibilities

• Design microelectronic modules and components.
• Generate product documentation including specifications and drawings.
• Support business development and customer interfacing.

Skills

Communication

Teamwork

Education

Bachelor’s Degree in Mechanical Engineering

Relevant Degree in Physics

Tools

AutoCad

SolidWorks

Cadence Allegro Package Designer Plus

Job description

Advanced Microsystems Technologies, AMT, is a technology division of Sanmina Corporation (Nasdaq: SANM), responsible for RF, Microelectronic, Optical components and Integrated Subsystems, providing services from design concept, through prototype design and testing, process development, assembly and test innovation, to volume manufacturing. We are extremely proud to partner with our customers enabling their product through the full product lifecycle.

At AMT, you will work on some of the most innovative programs and products that address emerging markets, including optical and RF communication, datacenter connectivity, quantum computing, automotive sensing systems, medical devices and diagnostics and test & measurement systems, to name a few.

Come and join us, and be part of a team that challenges you to be your best, where you will be empowered to make a difference and where we are extremely proud of what we deliver, together.

Job Purpose

The Microelectronic Design Engineering team, as part of Sanmina’s Global Design Engineering Team, represents one of the key strategic growth areas of the total engineering service offering. Our team provides engineering and design services in microelectronic, optical and semiconductor packaging and component design supported through its in depth background in materials technology, thermal, structural and reliability engineering.

We are seeking a Microelectronic Packaging Design Engineer to join our team and support both technology and product development programs, from initial technology selection and concept definition through detailed design, prototyping, qualification and volume manufacturing phases.

Nature of Duties/Responsibilities:

• Selection and definition of microelectronic technologies and design concepts, based on product applications, requirements and specifications.
• Design of microelectronic modules, component and packages, including substrate layout and detailed designs integrating elements of material selections, mechanical and thermal design as well as incorporating key aspects of reliability, electrical (RF), optical, test and process engineering for volume manufacturing.
• Contribute to microelectronic design and engineering activities as part of a multidisciplinary product development team including electrical/RF engineering optical engineering, reliability engineering, layout, documentation, manufacturing/process engineering and test engineering, in line with customer requirements and specifications.
• Generate product documentation including design specifications, drawings (piece parts, assembly, process) Bill of Materials, documentation release by engineering change order (ECO).
• Define specifications/requirements and coordinate/interface with manufacturers/suppliers for outsourced custom components.
• Perform and support engineering product verification, ensuring compliance to product requirements.
• Support business development initiatives including interfacing with potential and existing customer, preparation of marketing materials, proposals and quotations.
• Support turnkey product development process through to manufacturing implementation.

Education and Experience:

• Bachelor’s Degree in Mechanical Engineering, Physics, or other relevant degree with experience in electronic hardware design and packaging including multi-chip modules and semiconductor packaging for RF/Microwave/Optical applications.
• Minimum of 5 years’ of relevant experience.
• Experience in Wafer Level Packaging (WLP) and Chip Scale Packaging (CSP).
• Background or relevant experience in microelectronic technologies, materials, components, manufacturing methods.
• Experience in end-to-end product development and manufacturing implementation.
• Proficient in computer aided design software and tools (AutoCad, SolidWorks).
• Familiar with packaging and substrate design software (Cadence Allegro Package Designer Plus).
• Familiar with commercial FEA software and tools in support of thermal, structural and fatigue (solder joint reliability) analysis.
• Security clearance is an asset.
• Customer focused with strong communication skills, and has the ability to work within a multidisciplinary product development team in a fast-paced and challenging environment.

Sanmina welcomes and encourages applications from persons with disabilities. In accordance with the guidelines established under the Accessibility for Ontarians with Disabilities Act (AODA), accommodations are available on request for candidates taking part in all aspects of the selection process.