MEMS Process Development Engineer

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Aceinna Inc.
Okotoks
USD 70,000 - 110,000
Be among the first applicants.
2 days ago
Job description

Job Title: MEMS Process Development Engineer

Position: Full-Time

Location: Tewksbury, MA

If you love technology, innovation, collaboration and have an entrepreneurial mindset ACEINNA is for you! While ACEINNA's products and technologies are built on years of innovation and development efforts, we pride ourselves on being innovative, fast growing and a technology-driven company. Our passion is to create winning products, provide customer satisfaction, generate financial return to our investors and offer a rewarding and exciting work platform for our employees.

Job Overview

The MEMS Process Engineer will work closely with the ASIC and sensor design/fabrication teams throughout the product development cycle. This engineer will have ownership over a wide variety of MEMS specific process development responsibilities to facilitate full wafer processing for Aceinna's early-stage sensor prototypes. This position reports to Sensor Development Department.

What you'll be doing

  1. Perform Semiconductor/MEMS wafer processing tasks.
  2. Develop new silicon fabrication processes needed to achieve functionality of high-performance inertial sensor.
  3. Create and generate a full process flow needed to produce a full functional sensor device and validate its functionality.
  4. Coordinate and work in multiple University/R&D lab environments to complete a full sensor fabrication.
  5. Collaborate with sensor design engineers to troubleshoot and fix product issues.
  6. Support customers with engineering samples and issues.
  7. Interface with module design, production, and quality teams to transition products into volume production.

What You'll Bring

  1. Electrical, Material or Chemical engineering degree (MS required, PhD preferred) with 3+ years of experience and a proven track record of developing successful MEMS specific processes.
  2. Knowledge of MEMS wafer processing including Multiple wafer bonding and associated wafer alignment, Deep Reactive Ion Etching (DRIE), Vapor HF, Double side wafer processing.
  3. Experience working in university/lab environment of silicon wafer processing.
  4. Experience working with external service providers to accomplish MEMS processing.
  5. Experience with data analysis tools such as JMP, Minitab, or Matlab.
  6. High level of ability to work autonomously and independently.
  7. Strong communicator, strong negotiator, follow-through executor.

Desired Skills:

  1. MEMS/Semiconductor wafer processing experience is required.
  2. MEMS sensor development experience is a plus.
  3. Semiconductor packaging knowledge is a plus.
  4. Mask layout skill using L-Edit or equivalent is a plus.
  5. Knowledge of SPC, DOE and FMEA, Six Sigma tool is a plus.

Interested candidates should forward resume to careers@aceinna.com.

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