Mechanical Engineer

ZenaTech Inc.; Toronto; On-site; CAD 75,000 - 105,000; Full time

Job summary

ZenaTech Inc. in Toronto is seeking an experienced Mechanical Design Engineer to fit dense hardware into compact UAV enclosures. You will turn ID surfacing into production-ready CAD for molding, apply GD&T and DFM/DF A, and coordinate with mold makers to ensure manufacturability at scale.

You will collaborate across mechanical, electrical, and industrial design teams, owning internal layouts for sensors and power systems, while optimizing for thermal, EMI, and serviceability constraints.

Qualifications

• Bachelor's degree in Mechanical Engineering, Product Design, or related discipline.
• Minimum 4 years of mechanical design experience packaging electronics/sensors into space-constrained enclosures.
• Experience converting industrial design CAD into DFM-compliant, moldable production geometry.
• Strong working knowledge of injection molding design principles: draft, wall thickness, ribs/bosses, snap fits, warpage/sink prevention.
• Experience with tolerance stack-up analysis and GD&T (ASME Y14.5).
• Proficiency in PTC Creo (preferred) or equivalent parametric CAD (SolidWorks, NX).
• Comfortable translating between ID intent, electrical constraints, and manufacturing reality.

Responsibilities

• Own internal layout of LiDAR, cameras, GPS/RTK, radar, IMU, flight controllers, compute modules, batteries, antennas, and wiring within UAV airframes.
• Resolve placement conflicts between electrical, structural, and industrial design requirements sensor line-of-sight, antenna keep-out zones, thermal paths, wire routing, service access.
• Develop internal mounting structures, brackets, standoffs, and EMI/thermal isolation features.
• Perform tolerance stack-up analysis across internal assemblies to ensure fit of densely packaged components.
• Take industrial design surface models and rework them into engineering-intent, production-ready CAD suitable for injection molding.
• Apply DFM/DFA principles to ID geometry: correct draft angles, uniform wall thickness, rib/boss placement, snap-fit and fastener strategy.
• Coordinate directly with mold makers and contract manufacturers on tooling feasibility, gate/ejector placement, and moldflow concerns.
• Support prototype builds, iterate quickly on fit/function issues, and prepare BOMs, drawings, and revision documentation.

Skills

Mechanical design

Tolerance analysis

GD&T

DFM

Cross-disciplinary collaboration

Education

Bachelor's degree in Mechanical Engineering

Tools

PTC Creo

SolidWorks

Windchill

Job description

You will own internal component placement, packaging, and integration across UAV airframes — and translate industrial design CAD into production-ready, injection-moldable geometry.

Working closely with industrial design, electrical engineering, and manufacturing/tooling partners, you'll resolve the constant tension between exterior form, internal packaging density, thermal and EMI considerations, and serviceability. This role reports to the Engineering Manager and is ideal for someone who enjoys the puzzle of fitting dense hardware into a small, weight-constrained volume and has the discipline to turn beautiful ID surfacing into a part that actually molds.

This role would be located at 69 Yonge Street, Toronto Ontario M5E 1K3

What You'll Do

Sensor & Internal Component Placement

• Own internal layout of LiDAR, cameras, GPS/RTK, radar, IMU, flight controllers, compute modules, batteries, antennas, and wiring harnesses within UAV airframes
• Resolve placement conflicts between electrical, structural, and industrial design requirements sensor line-of-sight, antenna keep-out zones, thermal paths, wire routing, service access
• Develop internal mounting structures, brackets, standoffs, and EMI/thermal isolation features
• Perform tolerance stack-up analysis across internal assemblies to ensure fit of densely packaged components
• Take industrial design surface models and rework them into engineering-intent, production-ready CAD suitable for injection molding
• Apply DFM/DFA principles to ID geometry: correct draft angles, uniform wall thickness, rib/boss placement, snap-fit and fastener strategy — without compromising exterior form language
• Coordinate directly with mold makers and contract manufacturers on tooling feasibility, gate/ejector placement, and moldflow concerns introduced by internal features
• Support prototype builds, iterate quickly on fit/function issues, and prepare BOMs, drawings, and revision documentation for internal assemblies

What You'll Be Designing

• Internal Sensor Mounts (LiDAR, camera, GPS/RTK housings)
• Battery Bay Layout (retention and internal fit)
• Wiring Harness Routing (paths and connector access)
• Brackets & Standoffs (internal structural reinforcement)
• Production Housings (moldable geometry from ID surfacing)

What You Bring

• Bachelor's degree in Mechanical Engineering, Product Design, or related discipline
• Minimum 4 years of mechanical design experience, with direct experience packaging electronics/sensors into space-constrained enclosures
• Demonstrated experience converting industrial design (surfacing-focused) CAD into DFM-compliant, moldable production geometry
• Strong working knowledge of injection molding design principles: draft, wall thickness, ribs/bosses, snap fits, warpage/sink prevention
• Experience with tolerance stack-up analysis and GD&T (ASME Y14.5)
• Proficiency in PTC Creo (preferred) or equivalent parametric CAD (SolidWorks, NX)
• Comfortable working across disciplines — translating between ID intent, electrical constraints, and manufacturing reality

Nice to Have

• Experience with UAV, robotics, or compact electromechanical products (consumer electronics, wearables, handhelds)
• Sensor integration constraints: optical line-of-sight, RF/antenna keep-out, thermal dissipation for compute modules
• Familiarity with wire harness routing and connector placement in dense assemblies
• Experience with Moldflow, Moldex3D, or equivalent
• Familiarity with Windchill or similar PDM/PLM systems
• Exposure to EMI shielding and thermal management strategies in small enclosures
• Working knowledge of STEP / IGES / Parasolid data exchange

We use artificial intelligence to review and screen applications and materials. However, every candidate we move forward with is reviewed and selected, and all final hiring decisions are made by a member of our hiring team.

“We are an equal opportunity employer committed to employment equity utilizing hiring practices on merit and business needs. We encourage applications from women, Indigenous peoples, persons with disabilities, members of visible minorities and all others of legally protected status.”